Parameter Name | Attribute value |
Brand Name | Texas Instruments |
Is it Rohs certified? | conform to |
Maker | Texas Instruments(德州仪器) |
Parts packaging code | BGA |
package instruction | LFBGA, BGA108,12X12,32 |
Contacts | 108 |
Reach Compliance Code | compli |
Has ADC | YES |
Address bus width | |
bit size | 32 |
maximum clock frequency | 0.032 MHz |
DAC channel | NO |
DMA channel | NO |
External data bus width | |
JESD-30 code | S-PBGA-B108 |
JESD-609 code | e1 |
length | 10 mm |
Humidity sensitivity level | 3 |
Number of I/O lines | 43 |
Number of terminals | 108 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
PWM channel | YES |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFBGA |
Encapsulate equivalent code | BGA108,12X12,32 |
Package shape | SQUARE |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 2.5,3.3 V |
Certification status | Not Qualified |
RAM (bytes) | 16384 |
rom(word) | 65536 |
ROM programmability | FLASH |
Maximum seat height | 1.5 mm |
speed | 50 MHz |
Maximum supply voltage | 2.75 V |
Minimum supply voltage | 2.25 V |
Nominal supply voltage | 2.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Silver/Copper (Sn/Ag/Cu) |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 10 mm |
uPs/uCs/peripheral integrated circuit type | MICROCONTROLLER, RISC |