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GS88236CGB-200I

Among 4 related components, GS88236CGB-200I have related pdf.
Part Number Manufacturer Description Datasheet
GS88236CGB-200I GSI Technology SRAM 2.5 or 3.3V 256K x 36 9M Download
GS88236CGB-200IT GSI Technology Cache SRAM, 256KX36, 6.5ns, CMOS, PBGA119, ROHS COMPLIANT, FPBGA-119 Download
GS88236CGB-200IV GSI Technology SRAM 1.8/2.5V 256K x 36 9M Download
GS88236CGB-200IVT GSI Technology Cache SRAM, 256KX36, 6.5ns, CMOS, PBGA119, ROHS COMPLIANT, FPBGA-119 Download
GS88236CGB-200I parameters:

Description

SRAM 2.5 or 3.3V 256K x 36 9M

Parametric
Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerGSI Technology
Parts packaging codeBGA
package instructionBGA,
Contacts119
Reach Compliance Codecompliant
ECCN code3A991.B.2.B
Factory Lead Time8 weeks
Maximum access time6.5 ns
Other featuresPIPELINED/FLOW-THROUGH ARCHITECTURE, IT ALSO OPERATES WITH 3 V TO 3.6 V SUPPLY
JESD-30 codeR-PBGA-B119
JESD-609 codee1
length22 mm
memory density9437184 bit
Memory IC TypeCACHE SRAM
memory width36
Humidity sensitivity level3
Number of functions1
Number of terminals119
word count262144 words
character code256000
Operating modeSYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize256KX36
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeRECTANGULAR
Package formGRID ARRAY
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)260
Certification statusNot Qualified
Maximum seat height1.77 mm
Maximum supply voltage (Vsup)2.7 V
Minimum supply voltage (Vsup)2.3 V
Nominal supply voltage (Vsup)2.5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Silver/Copper (Sn/Ag/Cu)
Terminal formBALL
Terminal pitch1.27 mm
Terminal locationBOTTOM
Maximum time at peak reflow temperatureNOT SPECIFIED
width14 mm

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