Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | Rochester Electronics |
Parts packaging code | QFP |
package instruction | LEAD FREE, PLASTIC, MS-026, TQFP-100 |
Contacts | 100 |
Reach Compliance Code | unknown |
Maximum access time | 55 ns |
JESD-30 code | S-PQFP-G100 |
JESD-609 code | e3 |
length | 14 mm |
memory density | 131072 bit |
Memory IC Type | DUAL-PORT SRAM |
memory width | 16 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 100 |
word count | 8192 words |
character code | 8000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 8KX16 |
Package body material | PLASTIC/EPOXY |
encapsulated code | LFQFP |
Package shape | SQUARE |
Package form | FLATPACK, LOW PROFILE, FINE PITCH |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
Certification status | COMMERCIAL |
Maximum seat height | 1.6 mm |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | MATTE TIN |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 20 |
width | 14 mm |