Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | ROHM(罗姆半导体) |
Parts packaging code | BGA |
package instruction | VFBGA, BGA8,3X3,20 |
Contacts | 8 |
Reach Compliance Code | compliant |
Factory Lead Time | 13 weeks |
Commercial integrated circuit types | CONSUMER CIRCUIT |
JESD-30 code | S-PBGA-B8 |
length | 1.68 mm |
Number of functions | 1 |
Number of terminals | 8 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
Package body material | PLASTIC/EPOXY |
encapsulated code | VFBGA |
Encapsulate equivalent code | BGA8,3X3,20 |
Package shape | SQUARE |
Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3 V |
Certification status | Not Qualified |
Maximum seat height | 1 mm |
Maximum supply voltage (Vsup) | 3.45 V |
Minimum supply voltage (Vsup) | 2.5 V |
surface mount | YES |
Temperature level | INDUSTRIAL |
Terminal form | BALL |
Terminal pitch | 0.5 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 1.68 mm |