Part Number |
AT28HC256-12FM |
AT28HC256-12FM |
Description |
EEPROM, 32KX8, 120ns, Parallel, CMOS, CDFP28 |
EEPROM, 32KX8, 120ns, Parallel, CMOS, CDFP28, BOTTOM BRAZED, CERAMIC, DFP-28 |
Is it Rohs certified? |
incompatible |
incompatible |
package instruction |
BOTTOM BRAZED, CERAMIC, DFP-28 |
DFP, FL28,.4 |
Reach Compliance Code |
not_compliant |
compliant |
ECCN code |
EAR99 |
EAR99 |
Is Samacsys |
N |
N |
Maximum access time |
120 ns |
120 ns |
Other features |
AUTOMATIC WRITE |
AUTOMATIC WRITE |
command user interface |
NO |
NO |
Data polling |
YES |
YES |
Durability |
10000 Write/Erase Cycles |
10000 Write/Erase Cycles |
JESD-30 code |
R-CDFP-F28 |
R-CDFP-F28 |
JESD-609 code |
e0 |
e0 |
length |
18.3 mm |
18.3 mm |
memory density |
262144 bit |
262144 bit |
Memory IC Type |
EEPROM |
EEPROM |
memory width |
8 |
8 |
Number of functions |
1 |
1 |
Number of terminals |
28 |
28 |
word count |
32768 words |
32768 words |
character code |
32000 |
32000 |
Operating mode |
ASYNCHRONOUS |
ASYNCHRONOUS |
Maximum operating temperature |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
organize |
32KX8 |
32KX8 |
Output characteristics |
3-STATE |
3-STATE |
Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
encapsulated code |
DFP |
DFP |
Encapsulate equivalent code |
FL28,.4 |
FL28,.4 |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
FLATPACK |
FLATPACK |
page size |
64 words |
64 words |
Parallel/Serial |
PARALLEL |
PARALLEL |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
power supply |
5 V |
5 V |
Programming voltage |
5 V |
5 V |
Certification status |
Not Qualified |
Not Qualified |
Maximum seat height |
3.02 mm |
3.02 mm |
Maximum standby current |
0.06 A |
0.06 A |
Maximum slew rate |
0.133 mA |
0.133 mA |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
4.5 V |
4.5 V |
Nominal supply voltage (Vsup) |
5 V |
5 V |
surface mount |
YES |
YES |
technology |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
TIN LEAD |
Tin/Lead (Sn/Pb) |
Terminal form |
FLAT |
FLAT |
Terminal pitch |
1.27 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
switch bit |
YES |
YES |
width |
10.16 mm |
10.16 mm |
Maximum write cycle time (tWC) |
3 ms |
3 ms |
Base Number Matches |
1 |
1 |