Part Number | Datasheet |
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71T016L150BF 、 71T016L150BFI 、 71T016L150PH 、 71T016L150PHI 、 71T016L200BF 、 71T016L200BFI 、 71T016L200PH 、 71T016L200PHI | Download Datasheet |
71T016SA15BFG 、 71T016SA15BFGI 、 71T016SA20BFG 、 71T016SA20BFGI | Download Datasheet |
71T016SA15BFG8 、 71T016SA20BFG8 | Download Datasheet |
71T016SA10Y | Download Datasheet |
Part Number | 71T016L150BF | 71T016L150BFI | 71T016L150PH | 71T016L150PHI | 71T016L200BF | 71T016L200BFI | 71T016L200PH | 71T016L200PHI |
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Description | Standard SRAM, 64KX16, 150ns, CMOS, PBGA46, 7 X 9 MM, 1.40 MM HEIGHT, 0.75 MM PITCH, FPBGA-46 | Standard SRAM, 64KX16, 150ns, CMOS, PBGA46, 7 X 9 MM, 1.40 MM HEIGHT, 0.75 MM PITCH, FPBGA-46 | Standard SRAM, 64KX16, 150ns, CMOS, PDSO44, 0.400 INCH, MS-024AC, TSOP2-44 | Standard SRAM, 64KX16, 150ns, CMOS, PDSO44, 0.400 INCH, MS-024AC, TSOP2-44 | Standard SRAM, 64KX16, 200ns, CMOS, PBGA46, 7 X 9 MM, 1.40 MM HEIGHT, 0.75 MM PITCH, FPBGA-46 | Standard SRAM, 64KX16, 200ns, CMOS, PBGA46, 7 X 9 MM, 1.40 MM HEIGHT, 0.75 MM PITCH, FPBGA-46 | Standard SRAM, 64KX16, 200ns, CMOS, PDSO44, 0.400 INCH, MS-024AC, TSOP2-44 | Standard SRAM, 64KX16, 200ns, CMOS, PDSO44, 0.400 INCH, MS-024AC, TSOP2-44 |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
package instruction | LFBGA, BGA48,6X8,30 | LFBGA, BGA48,6X8,30 | TSOP2, TSOP44,.46,32 | TSOP2, TSOP44,.46,32 | LFBGA, BGA48,6X8,30 | LFBGA, BGA48,6X8,30 | TSOP2, TSOP44,.46,32 | TSOP2, TSOP44,.46,32 |
Reach Compliance Code | _compli | _compli | _compli | _compli | _compli | _compli | _compli | _compli |
Maximum access time | 150 ns | 150 ns | 150 ns | 150 ns | 200 ns | 200 ns | 200 ns | 200 ns |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-PBGA-B46 | R-PBGA-B46 | R-PDSO-G44 | R-PDSO-G44 | R-PBGA-B46 | R-PBGA-B46 | R-PDSO-G44 | R-PDSO-G44 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
length | 8.9 mm | 8.9 mm | 18.41 mm | 18.41 mm | 8.9 mm | 8.9 mm | 18.41 mm | 18.41 mm |
memory density | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi | 1048576 bi |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Humidity sensitivity level | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 46 | 46 | 44 | 44 | 46 | 46 | 44 | 44 |
word count | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words |
character code | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 | 64000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C |
organize | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 | 64KX16 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | LFBGA | LFBGA | TSOP2 | TSOP2 | LFBGA | LFBGA | TSOP2 | TSOP2 |
Encapsulate equivalent code | BGA48,6X8,30 | BGA48,6X8,30 | TSOP44,.46,32 | TSOP44,.46,32 | BGA48,6X8,30 | BGA48,6X8,30 | TSOP44,.46,32 | TSOP44,.46,32 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, LOW PROFILE, FINE PITCH | GRID ARRAY, LOW PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
Peak Reflow Temperature (Celsius) | 225 | 225 | 225 | 225 | 225 | 225 | 225 | 225 |
power supply | 1.8/2.7 V | 1.8/2.7 V | 1.8/2.7 V | 1.8/2.7 V | 1.8/2.7 V | 1.8/2.7 V | 1.8/2.7 V | 1.8/2.7 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.4 mm | 1.4 mm | 1.2 mm | 1.2 mm | 1.4 mm | 1.4 mm | 1.2 mm | 1.2 mm |
Maximum standby current | 0.000005 A | 0.00001 A | 0.000005 A | 0.000005 A | 0.000005 A | 0.00001 A | 0.000005 A | 0.000005 A |
Minimum standby current | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Maximum slew rate | 0.02 mA | 0.02 mA | 0.02 mA | 0.02 mA | 0.017 mA | 0.017 mA | 0.017 mA | 0.017 mA |
Maximum supply voltage (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
Minimum supply voltage (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Nominal supply voltage (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn63Pb37) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
Terminal form | BALL | BALL | GULL WING | GULL WING | BALL | BALL | GULL WING | GULL WING |
Terminal pitch | 0.75 mm | 0.75 mm | 0.8 mm | 0.8 mm | 0.75 mm | 0.75 mm | 0.8 mm | 0.8 mm |
Terminal location | BOTTOM | BOTTOM | DUAL | DUAL | BOTTOM | BOTTOM | DUAL | DUAL |
Maximum time at peak reflow temperature | 30 | 30 | 30 | 30 | 30 | 30 | 30 | 30 |
width | 6.9 mm | 6.9 mm | 10.16 mm | 10.16 mm | 6.9 mm | 6.9 mm | 10.16 mm | 10.16 mm |