Parameter Name | Attribute value |
Brand Name | Integrated Device Technology |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | SOJ |
package instruction | SOJ, SOJ32,.34 |
Contacts | 32 |
Manufacturer packaging code | PJG32 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.A |
Samacsys Description | SOIC 300 MIL- J BEND |
Maximum access time | 20 ns |
I/O type | COMMON |
JESD-30 code | R-PDSO-J32 |
JESD-609 code | e3 |
length | 20.96 mm |
memory density | 1048576 bit |
Memory IC Type | STANDARD SRAM |
memory width | 8 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 32 |
word count | 131072 words |
character code | 128000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 128KX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOJ |
Encapsulate equivalent code | SOJ32,.34 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 3.76 mm |
Maximum standby current | 0.01 A |
Minimum standby current | 4.5 V |
Maximum slew rate | 0.14 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Matte Tin (Sn) - annealed |
Terminal form | J BEND |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 7.62 mm |
Base Number Matches | 1 |