Part Number |
24AA014-IT/MC |
24AA014-IT/MS |
24AA014-IT/SN |
24AA014-IT/ST |
Description |
128 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 2 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8 |
128 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, ROHS COMPLIANT, PLASTIC, MSOP-8 |
128 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 |
128 X 8 I2C/2-WIRE SERIAL EEPROM, PDSO8, 4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 |
Is it lead-free? |
Lead free |
Lead free |
Lead free |
Lead free |
Is it Rohs certified? |
conform to |
conform to |
conform to |
conform to |
Parts packaging code |
DFN |
MSOP |
SOIC |
SOIC |
package instruction |
2 X 3 MM, 0.90 MM HEIGHT, ROHS COMPLIANT, PLASTIC, DFN-8 |
ROHS COMPLIANT, PLASTIC, MSOP-8 |
3.90 MM, ROHS COMPLIANT, PLASTIC, SOIC-8 |
4.40 MM, ROHS COMPLIANT, PLASTIC, TSSOP-8 |
Contacts |
8 |
8 |
8 |
8 |
Reach Compliance Code |
compli |
compli |
compli |
compli |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Maximum clock frequency (fCLK) |
0.4 MHz |
0.4 MHz |
0.4 MHz |
0.4 MHz |
JESD-30 code |
R-PDSO-N8 |
S-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
JESD-609 code |
e3 |
e3 |
e3 |
e3 |
length |
3 mm |
3 mm |
4.9 mm |
4.4 mm |
memory density |
1024 bi |
1024 bi |
1024 bi |
1024 bi |
Memory IC Type |
EEPROM |
EEPROM |
EEPROM |
EEPROM |
memory width |
8 |
8 |
8 |
8 |
Humidity sensitivity level |
1 |
1 |
1 |
1 |
Number of functions |
1 |
1 |
1 |
1 |
Number of terminals |
8 |
8 |
8 |
8 |
word count |
128 words |
128 words |
128 words |
128 words |
character code |
128 |
128 |
128 |
128 |
Operating mode |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
SYNCHRONOUS |
Maximum operating temperature |
85 °C |
85 °C |
85 °C |
85 °C |
Minimum operating temperature |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
organize |
128X8 |
128X8 |
128X8 |
128X8 |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
HVSON |
TSSOP |
SOP |
TSSOP |
Package shape |
RECTANGULAR |
SQUARE |
RECTANGULAR |
RECTANGULAR |
Package form |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
Parallel/Serial |
SERIAL |
SERIAL |
SERIAL |
SERIAL |
Peak Reflow Temperature (Celsius) |
260 |
260 |
260 |
260 |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Maximum seat height |
1 mm |
1.1 mm |
1.75 mm |
1.1 mm |
Serial bus type |
I2C |
I2C |
I2C |
I2C |
Maximum supply voltage (Vsup) |
5.5 V |
5.5 V |
5.5 V |
5.5 V |
Minimum supply voltage (Vsup) |
1.7 V |
1.7 V |
1.7 V |
1.7 V |
Nominal supply voltage (Vsup) |
2.5 V |
2.5 V |
2.5 V |
2.5 V |
surface mount |
YES |
YES |
YES |
YES |
technology |
CMOS |
CMOS |
CMOS |
CMOS |
Temperature level |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
Terminal surface |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Matte Tin (Sn) |
Terminal form |
NO LEAD |
GULL WING |
GULL WING |
GULL WING |
Terminal pitch |
0.5 mm |
0.65 mm |
1.27 mm |
0.65 mm |
Terminal location |
DUAL |
DUAL |
DUAL |
DUAL |
Maximum time at peak reflow temperature |
40 |
40 |
40 |
40 |
width |
2 mm |
3 mm |
3.9 mm |
3 mm |
Maximum write cycle time (tWC) |
5 ms |
5 ms |
5 ms |
5 ms |
Base Number Matches |
1 |
1 |
1 |
1 |