Basic information of TLV2252AMUB amplifier:
TLV2252AMUB is an OPERATIONAL AMPLIFIER from Texas Instruments. Commonly used packaging methods are CERAMIC, DFP-10
TLV2252AMUB amplifier core information:
The minimum operating temperature of the TLV2252AMUB is -55 °C and the maximum operating temperature is 125 °C. Its peak reflow temperature is NOT SPECIFIED Its maximum average bias current is 0.001 µA
How to simply check the efficiency of an amplifier? Looking at its slew rate, the TLV2252AMUB has a nominal slew rate of 0.1 V/us. The maximum slew rate of the TLV2252AMUB given by the manufacturer is 0.15 mA, while the minimum slew rate is 0.05 V/us. Its minimum voltage gain is 10000. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the TLV2252AMUB gain becomes 0.707 times the low-frequency gain is 187 kHz.
The nominal supply voltage of the TLV2252AMUB is 3 V. The power supply range is: 3/5 V. The input offset voltage of the TLV2252AMUB is 1000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of TLV2252AMUB:
The width of TLV2252AMUB is: 6.225 mm and the length is 6.475 mm. TLV2252AMUB has 10 terminals. Its terminal position type is: DUAL. Terminal pitch is 1.27 mm. Total pins: 10
TLV2252AMUB amplifier additional information:
TLV2252AMUB adopts the VOLTAGE-FEEDBACK architecture. It belongs to the low-bias class of amplifiers. It does not belong to the low offset class of amplifiers. The frequency compensation status of TLV2252AMUB is: YES. Its temperature grade is: MILITARY.
It is a micropower amplifier. TLV2252AMUB is not Rohs certified. It contains lead. The corresponding JESD-30 code is: S-GDFP-F10. The packaging code of TLV2252AMUB is: DFP.
The materials of TLV2252AMUB package are mostly CERAMIC, GLASS-SEALED. The package shape is SQUARE. The TLV2252AMUB package pin format is: FLATPACK. Its terminal form is: FLAT. The maximum seat height is 2.03 mm.
Basic information of TLV2252AMUB amplifier:
TLV2252AMUB is an OPERATIONAL AMPLIFIER from Texas Instruments. Commonly used packaging methods are CERAMIC, DFP-10
TLV2252AMUB amplifier core information:
The minimum operating temperature of the TLV2252AMUB is -55 °C and the maximum operating temperature is 125 °C. Its peak reflow temperature is NOT SPECIFIED Its maximum average bias current is 0.001 µA
How to simply check the efficiency of an amplifier? Looking at its slew rate, the TLV2252AMUB has a nominal slew rate of 0.1 V/us. The maximum slew rate of the TLV2252AMUB given by the manufacturer is 0.15 mA, while the minimum slew rate is 0.05 V/us. Its minimum voltage gain is 10000. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the TLV2252AMUB gain becomes 0.707 times the low-frequency gain is 187 kHz.
The nominal supply voltage of the TLV2252AMUB is 3 V. The power supply range is: 3/5 V. The input offset voltage of the TLV2252AMUB is 1000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)
Related dimensions of TLV2252AMUB:
The width of TLV2252AMUB is: 6.225 mm and the length is 6.475 mm. TLV2252AMUB has 10 terminals. Its terminal position type is: DUAL. Terminal pitch is 1.27 mm. Total pins: 10
TLV2252AMUB amplifier additional information:
TLV2252AMUB adopts the VOLTAGE-FEEDBACK architecture. It belongs to the low-bias class of amplifiers. It does not belong to the low offset class of amplifiers. The frequency compensation status of TLV2252AMUB is: YES. Its temperature grade is: MILITARY.
It is a micropower amplifier. TLV2252AMUB is not Rohs certified. It contains lead. The corresponding JESD-30 code is: S-GDFP-F10. The packaging code of TLV2252AMUB is: DFP.
The materials of TLV2252AMUB package are mostly CERAMIC, GLASS-SEALED. The package shape is SQUARE. The TLV2252AMUB package pin format is: FLATPACK. Its terminal form is: FLAT. The maximum seat height is 2.03 mm.
Parameter Name | Attribute value |
Brand Name | Texas Instruments |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Parts packaging code | DFP |
package instruction | CERAMIC, DFP-10 |
Contacts | 10 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Amplifier type | OPERATIONAL AMPLIFIER |
Architecture | VOLTAGE-FEEDBACK |
Maximum average bias current (IIB) | 0.001 µA |
Nominal Common Mode Rejection Ratio | 77 dB |
frequency compensation | YES |
Maximum input offset voltage | 1000 µV |
JESD-30 code | S-GDFP-F10 |
length | 6.475 mm |
low-bias | YES |
low-dissonance | NO |
micropower | YES |
Number of functions | 2 |
Number of terminals | 10 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DFP |
Encapsulate equivalent code | FL10,.3 |
Package shape | SQUARE |
Package form | FLATPACK |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3/5 V |
Certification status | Not Qualified |
Filter level | MIL-STD-883 |
Maximum seat height | 2.03 mm |
minimum slew rate | 0.05 V/us |
Nominal slew rate | 0.1 V/us |
Maximum slew rate | 0.15 mA |
Supply voltage upper limit | 8 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | MILITARY |
Terminal form | FLAT |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Nominal Uniform Gain Bandwidth | 187 kHz |
Minimum voltage gain | 10000 |
width | 6.225 mm |
Base Number Matches | 1 |