EEWORLDEEWORLDEEWORLD

Part Number

Search

ZMM5255A_R1_10001

Description
Zener Diode
CategoryDiscrete semiconductor    diode   
ManufacturerPANJIT
Websitehttp://www.panjit.com.tw/
Environmental Compliance

PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values ​​include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

Download Datasheet Parametric View All

ZMM5255A_R1_10001 Overview

Zener Diode

ZMM5255A_R1_10001 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPANJIT
package instructionO-LELF-R2
Reach Compliance Codecompliant
ECCN codeEAR99
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance44 Ω
JESD-30 codeO-LELF-R2
Maximum knee impedance600 Ω
Number of components1
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-65 °C
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
polarityUNIDIRECTIONAL
Maximum power dissipation0.5 W
Nominal reference voltage28 V
Maximum reverse current0.1 µA
Reverse test voltage21 V
surface mountYES
technologyZENER
Terminal formWRAP AROUND
Terminal locationEND
Maximum voltage tolerance3%
Working test current4.5 mA

ZMM5255A_R1_10001 Preview

Download Datasheet
ZMM5221B~ZMM5266B
SURFACE MOUNT ZENER DIODES
VOLTAGE
2.4 to 68 Volts
POWER
500 mWatts
FEATURES
• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
0.063(1.6)
0.020(0.5)
0.012(0.3)
0.146(3.7)
0.130(3.3)
0.055(1.4)DIA.
• Lead free in comply with EU RoHS 2011/65/EU directives
MECHANICAL DATA
• Case: Molded Glass MINI-MELF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 0.03 grams
• Packing information
T/R - 2.5K per 7" plastic Reel
0.020(0.5)
0.012(0.3)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Parameter
Power Dissipation at T
A
= 25
O
C
Operating Junction Temperature Range
Storage Temperature Range
Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.
Symbol
P
TOT
T
J
T
STG
Value
500
-65 to +175
-65 to +175
Units
mW
O
C
C
O
Parameter
Thermal Resistance Junction to Ambient Air
Forward Voltage at I
F
= 200mA
Symbol
R
JA
V
F
Min.
--
--
Typ.
--
--
Max.
0.3
1.1
o
Units
C/mW
V
Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.
October 21,2013-REV.06
PAGE . 1
【Silicon Labs BG22-EK4108A Bluetooth Development Review】EFRConnect Mobile Applicationw and Issues
[i=s]This post was last edited by damiaa on 2022-1-6 10:29[/i][Silicon Labs BG22-EK4108A Bluetooth Development Review] 1. EFRConnect Mobile Applicationw and Issues 1. [Silicon Labs BG22-EK4108A Blueto...
damiaa Development Kits Review Area
kicad-age_12-layer_ciaa_acc
...
ohahaha PCB Design
Goodbye 2019, Hello 2020 + Standing at the Crossroads of Life
I have been thinking about writing something for a long time, but when I picked up the pen, I didn't know what to write. 2019 has passed, and my " 3.0 " life has come to an end. I am about to enter th...
yichun417 Talking
Application of FPGA in barcode reader.zip
Application of FPGA in barcode reader.zip...
zxopenljx EE_FPGA Learning Park
【GD32307E-START】02-Drawing of mechanical dimension drawings
[i=s]This post was last edited by Shen Xiaolin on 2020-9-27 18:13[/i]I asked GD for a dimension drawing earlier, but it was never given to me. Today I received the development board, so I drew the mec...
申小林 GD32 MCU
Xunwei i.MX6ULL Terminator Buildoot file system construction chapter buildroot file system test
The uboot, kernel, and device tree required for the buildroot file system are all compiled before or provided in the document. We transfer the compiled image to the burning tool via ssh.Switch the dev...
饥饿又奈奈66 ARM Technology

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews

Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190

Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号