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ZMM5239C

Description
Zener Diode, 9.1V V(Z), 10%, 0.5W, Silicon, Unidirectional, ROHS COMPLIANT, GLASS, LL-34, MINIMELF-2
CategoryDiscrete semiconductor    diode   
File Size97KB,4 Pages
ManufacturerPANJIT
Websitehttp://www.panjit.com.tw/
Environmental Compliance

PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values ​​include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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ZMM5239C Overview

Zener Diode, 9.1V V(Z), 10%, 0.5W, Silicon, Unidirectional, ROHS COMPLIANT, GLASS, LL-34, MINIMELF-2

ZMM5239C Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerPANJIT
Parts packaging codeMELF
package instructionO-LELF-R2
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
Shell connectionISOLATED
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance10 Ω
JESD-30 codeO-LELF-R2
Number of components1
Number of terminals2
Maximum operating temperature175 °C
Package body materialGLASS
Package shapeROUND
Package formLONG FORM
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityUNIDIRECTIONAL
Maximum power dissipation0.5 W
Certification statusNot Qualified
Nominal reference voltage9.1 V
surface mountYES
technologyZENER
Terminal formWRAP AROUND
Terminal locationEND
Maximum time at peak reflow temperatureNOT SPECIFIED
Maximum voltage tolerance10%
Working test current20 mA
Base Number Matches1

ZMM5239C Preview

Download Datasheet
ZMM5221B~ZMM5267B
SURFACE MOUNT ZENER DIODES
VOLTAGE
2.4 to 75 Volts
POWER
500 mWatts
MINI-MELF/LL-34
Unit : inch (mm)
FEATURES
• Planar Die construction
• 500mW Power Dissipation
• Ideally Suited for Automated Assembly Processes
.055(1.4)DIA.
• In compliance with EU RoHS 2002/95/EC directives
.063(1.6)
MECHANICAL DATA
• Case: Molded Glass MINI-MELF
• Terminals: Solderable per MIL-STD-750, Method 2026
• Polarity: See Diagram Below
• Approx. Weight: 0.03 grams
• Mounting Position: Any
• Packing information
T/R - 2.5K per 7" plastic Reel
.020(0.5)
.012(0.3)
.146(3.7)
.130(3.3)
.020(0.5)
.012(0.3)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Parameter
Power Dissipation at Tamb = 25
Junction Temperature
Storage Temperature Range
Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.
O
Symbol
P
TOT
T
J
T
S
Value
500
175
-65 to +175
Units
mW
O
C
C
C
O
Parameter
Thermal Resistance Junction to Ambient Air
Forward Voltage at I
F
= 200mA
Symbol
R
θ
JA
V
F
Min.
--
--
Typ.
--
--
Max.
0.3
1.1
Units
K/mW
V
Valid provided that leads at a distance of 10mm from case are kept at ambient temperature.
STAD-FEB.10.2009
PAGE . 1
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