TSA143TNND03 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> TSA143TNND03

Preview

TSA143TNND03: DescriptionDIGITAL TRANSISTOR (PNP)Digital transistor (PNP); CategoryDiscrete semiconductor; File Size362KB，1 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet View All

TSA143TNND03 Overview

DIGITAL TRANSISTOR (PNP)Digital transistor (PNP)

Features

Product Name: DIGITAL TRANSISTOR (PNP)

Product model:TSA143TNND03

Product Description:

Built-in bias resistors enable the configuration of an inverter circuit without connecting external input

resistors(see equivalent circuit)

The bias resistors consist of thin-film resistors with complete isolation to allow positive biasing of the

input.They also have the advantage of almost completely eliminating parasitic effects

Only the on/off conditions need to be set for operation, making device design easy

parameter:

Polarity: PNP

PD (power consumption): 150mW

Io (output current): 100mA

Vcc (power supply voltage): 50V

GI (DC Current Gain): 100

Vo (on) (output current): 0.3V

R1: 4.7K+Ω

R2:∞

fT (transition frequency): 250+MHz

Package: WBFBP-03B

TSA143TNND03 Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

WBFBP-03B Plastic-Encapsulate Transistors

TSA143TNND03

DESCRIPTION

PNP Digital Transistor

FEATURES

1) Built-in bias resistors enable the configuration of an

inverter circuit

without connecting external input

resistors (see equivalent circuit)

2) The bias resistors consist of thin-film resistors with

to allow

positive

biasing of the

input. They also have the advantage of

almost

completely eliminating parasitic effects

3) Only the on/off conditions need to be set for operation,

making device design easy

APPLICATION

PNP Digital Transistor

For portable equipment:(i.e.

Mobile phone,MP3, MD,CD-ROM,

DVD-ROM, Note

book PC, etc.)

MARKING: 93

equivalent circuit

TRANSISTOR

WBFBP-03B

(1.2×1.2×0.5)

unit: mm

TOP

BACK

1. IN

2. GND

3. OUT

Absolute maximum ratings(Ta=25℃)

Parameter

Collector-base

Voltage

Collector-emitter voltage

Emitter-base voltage

Collector current

Collector Power dissipation

Junction temperature

Storage temperature

Symbol

(BR)CBO

(BR)CEO

(BR)EBO

stg

Value

-50

-5

-100

150

-55~150

Units

℃

Electrical characteristics (Ta=25℃)

Parameter

Collector-base breakdown voltage

Collector-emitter breakdown voltage

Emitter-base breakdown voltage

Collector cut-off current

Emitter cut-off current

Collector-emitter saturation voltage

DC current transfer ratio

Input resistance

Transition frequency

Symbol

(BR)CBO

(BR)CEO

(BR)EBO

CBO

EBO

CE(sat)

100

3.29

4.7

250

Min

-50

-5

-0.5

-0.3

600

6.11

KΩ

MHz

=-10V ,I

=5mA,f=100MHz

Typ

Max

Unit

μA

Conditions

=-50μA

=-1mA

=-50μA

=-50V

=-4V

=-5mA,I

=-0.25mA

=-5V,I

=-1mA

A,Jun,2011

Recommended Resources

External circuit structure of CPU clock signal generation circuit a

Multiple sets of colorful light chain circuits that flash in cycles (Part 2)

Arc spray power supply and starting circuit

Speech recognition circuit HM2006 typical application circuit

Differential transformer displacement sensor circuit

Resistor-Transistor Gate Circuit

Three color formats of CCS: !DOCTYPE htmlhtml lang="en"headmeta charset="utf-8"style.red {color: red;}li:nth-child(2) {color: #FF6600; /* Orange Colors should be in hexadecimal, abbreviated format*/}#rgb {color: rgb(0,0,255); /*...; Jacktang Microcontroller MCU

[ESP32-Audio-Kit Audio Development Board Review] 6. Key Test: I found the Arduino examples to be more interesting. You can study them, give them a new name, or put them in your own folder. I will test the key interrupt and put it in my own directory so that it i...; ddllxxrr RF/Wirelessly

MCU instruction system and assembly language program: [size=4][color=#000000][backcolor=white] The main components of a single-chip microcomputer constitute the hardware of the single-chip microcomputer. The so-called hardware is a visible and tangible e...; fish001 Microcontroller MCU

Connection parameters and other issues found in the use of CC2640R2F: Question 1: Connection parameter update issue when CC2640R2F BLE4.2 and Bluetooth 4.0 mobile phone are interconnected.The CC2640R2F development document states the following: A BLE peripheral device c...; Jacktang Wireless Connectivity

DM8148 sends Frames stream from DSP side to A8 side program configuration: I have been debugging DM8148 recently. According to the requirements, the data obtained by the camera needs to be sent to DSP for image processing and then sent to A8 for other processing (network sen...; fish001 DSP and ARM Processors

The voltage comparator has an excessive current problem at its input.: [i=s]This post was last edited by Mongoose on 2019-8-24 14:21[/i]background : I1 and I2 are 4-20mA current sources, which flow through the load RL. A wire is drawn from RL to the comparator. The compa...; 猫鼬 Analog electronics

Popular Components