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On June 14, 2019, the Summer Summit of Anchuang Future Technology Innovation "Core" Conference was successfully held in Shanghai. With the theme of "Gathering Strength and Breaking the Deadlock", t...[Details]

The semiconductor shortage problem is plaguing companies around the world, so many countries have increased their investment in semiconductor research and development, and this trend is intensifying....[Details]

On Tuesday (April 18) local time, EU Internal Market Commissioner Thierry Breton said on the 18th that the EU had reached an agreement on a 43 billion euro (approximately US$47 billion) semiconductor...[Details]

According to news on August 22, early this morning, British semiconductor IP giant Arm Holdings, a subsidiary of Japan’s SoftBank Group, officially submitted IPO documents to the U.S. Securities and ...[Details]

As one of the strategic foundation pillars throughout the integrated circuit design, manufacturing, packaging and testing links , EDA has become a "bottleneck" link that cannot be bypassed in C...[Details]

At 11:08 a.m. local time on February 13, a strong earthquake of magnitude 7.3 occurred in Japan. The epicenter was located off the coast of Fukushima Prefecture and the focal depth was 55 kilometers....[Details]

The two parties will focus on the development of automotive silicon carbide power devices to promote technological innovation in new energy vehicles. Recently, Shenzhen Basic Semiconductor Co., Lt...[Details]

Apple's goal of reaching 100% carbon neutrality by 2030 could be in jeopardy because of TSMC, which is aiming to be 100% carbon neutral by 2050, amid reports that the company has a huge impact on the...[Details]

Mobileye: The power that drives us forward EyeQ® chip shipments have exceeded 100 million units. For Mobileye, this is not just a number, it means safer roads, fewer traffic accident...[Details]

As we all know, semiconductor manufacturing involves a large number of chemicals, such as photoresists and etchants. For them, one raw material is used in large quantities, namely poly-and perfluor...[Details]

Samsung Electronics' latest high-bandwidth memory (HBM) chip has not passed Nvidia's test, Reuters reported on May 24. Three people familiar with the matter said the company's chips were affected b...[Details]

Recently, the HKM9000 GPU graphics processor independently developed by Xiangteng Company of the Aviation Industry Computing Institute has passed the joint test of the cockpit display and control s...[Details]

  Third quarter revenue of $3.56 billion  GAAP EPS was $0.61 and non-GAAP EPS was $0.74 Returned $724 million to shareholders   SANTA CLARA, Calif., August 15, 2019 – Applied Materials, Inc. (NAS...[Details]

Specialty glass giant expands FLEXINITY® structured glass family into advanced packaging With FLEXINITY® connect, glass circuit boards can not only solve the data latency and manufacturing problems...[Details]

On August 6, Samsung Electronics Vice Chairman Lee Jae-yong visited Samsung Semiconductor's semiconductor packaging plant in Onyang, South Chungcheong Province, not long ago, just after Japan exclude...[Details]