SD1060CS datasheet, PDF - EEWORLD Datasheet

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SD1060CS: DescriptionSchottky diodes; CategoryDiscrete semiconductor diode; File Size112KB，4 Pages; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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SD1060CS Overview

Schottky diodes

Features

Product Name: Schottky Diode

Product model: SD1060CS

parameter:

Repetitive reverse voltage peak Vrrm: 60V

Maximum average rectified current Io: 10A

Maximum forward surge current I FSM: 100A

Forward voltage drop VF: 0.75V when IF=5A

Maximum feedback current IR: 100uA when VR=60V

Package: TO-252/DPAK

SD1060CS Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	PANJIT
Parts packaging code	TO-252
package instruction	R-PSSO-G2
Contacts	4
Reach Compliance Code	_compli
ECCN code	EAR99
Other features	FREE WHEELING DIODE, LOW POWER LOSS
application	EFFICIENCY
Shell connection	CATHODE
Configuration	COMMON CATHODE, 2 ELEMENTS
Diode component materials	SILICON
Diode type	RECTIFIER DIODE
Maximum forward voltage (VF)	0.75 V
JEDEC-95 code	TO-252
JESD-30 code	R-PSSO-G2
Maximum non-repetitive peak forward current	100 A
Number of components	2
Phase	1
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Maximum output current	10 A
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum repetitive peak reverse voltage	60 V
surface mount	YES
technology	SCHOTTKY
Terminal form	GULL WING
Terminal location	SINGLE
Maximum time at peak reflow temperature	NOT SPECIFIED

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SD1020CS~SD1060CS

SCHOTTKY BARRIER RECTIFIERS

VOLTAGE

FEATURES

• Plastic package has Underwriters Laboratory

Flammability Classification 94V-O

• For surface mounted applications

• Low profile package

• Built-in strain relief

• Low power loss, High efficiency

• High surge capacity

• For use in low voltage high frequency inverters, free wheeling, and

polarity protection applications

•

Lead free in comply with EU RoHS 2002/95/EC directives

20 to 60 Volts

CURRENT

10.0 Ampere

MECHANICALDATA

• Case: TO-252 molded plastic

• Terminals: Solder plated, solderable per MIL-STD-750,Method 2026

• Polarity: As marking

• Weight: 0.0104 ounces, 0.297 grams.

MAXIMUM RATINGS AND DELECTRICAL CHARACTERISTICS

Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.

For capacitive load, derate current by 20%

PA RA M E TE R

M a xi m um R e c ur r e nt P e a k R e ve r s e V o l t a g e

M a xi m um R M S V o l t a g e

M a xi m um D C B l o c k i ng V o l t a g e

M a xi m um A ve r a g e F o r w a r d R e c t i f i e d C ur r e nt a t T

= 7 5

P e a k F o r w a r d S ur g e C ur r e nt : 8 . 3 m s s i ng l e ha l f s i ne -

w a ve s up e r i m p o s e d o n r a t e d l o a d ( J E D E C m e t ho d )

M a x i m u m In s t a n t a n e o u s F o r w a r d V o l t a g e a t 5 . 0 A p e r l e g

M a xi m um D C R e ve r s e C ur r e nt T

= 2 5

a t R a t e d D C B l o c k i ng V o l t a g e T

= 1 0 0

Ty p i c a l T h e r m a l R e s i s t a n c e

O p e r a t i n g J u n c t i o n Te m p e r a t u r e R a n g e

S t o r a g e Te m p e r a t u r e R a n g e

S YM B O L

S D 1 0 2 0 C S S D 1 0 3 0 C S S D 1 0 4 0 C S S D 1 0 5 0 C S S D 1 0 6 0 C S

U N I T S

RRM

RMS

F ( A V )

F S M

J C

J A

S TG

-5 5 to +1 2 5

0 .5 5

0 .2

5 .0

-5 5 to +1 5 0

1 0 .0

100

0 .7 5

0 .1

C /

NOTES:

1. Both Bonding and Chip structure are available.

STAD-APR.27.2009

PAGE . 1

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