SBU10A~SBU10M
SILICON SINGLE-PHASE BRIDGE RECTIFIER
VOLTAGE
FEATURES
• Plastic material has Underwriters Laboratory
Flammability Classification 94V-O
• Ideal for printed circuit board
• Reliable low cost construction ulilizing molded pastic technique.
• High temperature soldering guaranteed:
260°C/10 seconds/.375"(9.5mm) lead length at 5 lbs. (2.3kg) tension
• In compliance with EU RoHS 2002/95/EC directives
50 to 1000 Volts
CURRENT
10.0 Amperes
MECHANICAL DATA
• Case: Reliable low cost construction utilizing
• molded plastic technique
• Terminals: Leads solderable per MIL-STD-750, Method 2026
• Mounting position: Any
• Mounting torque: 5 in. lb. Max.
• Weight: 0.2 ounce, 5.6 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25°Cambient temperature unless otherwise specified. Resistive or inductive load, 60Hz.
For Capacitive load derate current by 20%.
PARAMETER
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Bridge Input Voltage
Maximum DC Blocking Voltage
Maximum Average Forward T
C
=100
O
C
Rectified Output Current at T
A
=40
O
C
I
2
t Rating for fusing ( t<8.3ms)
Peak Forward Surge Current single sine-wave superimposed on rated
load (JEDEC method)
Maximum Forward Voltage Drop per Bridge Element at10.0A
Maximum Reverse Leakage Current at Rated @ T
A
=25
O
C
Dc Blocking Voltage @ T
A
=100
O
C
Typical Thermal Resistance per leg (Note 2)
Typical Thermal Resistance per leg (Note 3)
Operating Junction and Storage Temperature Range
SYMBOL
SBU10A SBU10B SBU10D SBU10G SBU10J SBU10K SBU10M
UNITS
V
R R M
V
R M S
V
D C
I
F (A V )
I
2
t
I
F S M
V
F
I
R
R
θ
J A
R
θ
J C
T
J
,T
S T G
50
35
50
100
70
100
200
140
200
400
280
400
10.0
8.0
373
300
0.98
3.0
1000
14.0
2.5
-55 to + 150
O
600
420
600
800
560
800
1000
700
1000
V
V
V
A
A
2
se c
A pk
V pk
uA
C/W
O
C
NOTES:
1. Recommended mounting position is to bolt down on heatsink with silicone thermal compound for maximum heat transfer with #6 screw.
2. Units Mounted in free air, no heatsink, P.C.B at 0.375"(9.5mm) lead length with 0.5 x 0.5"(12 x 12mm)copper pads.
3. Units Mounted on a 2.0 x 1.6" x 0.3" thick (5 x 4 x 0.8cm) AL plate.
STAD-JAN.29.2007
PAGE . 1
SBU10A~SBU10M
100
10
HEAT-SINK
MOUNTING T
C
INSTANTA NEOUS FORWARD CURRENT
AMPERES
AVER AGE FORWARD CURR ENT
AMPE RES
40
20
10
4
2
1
0.4
0.2
0.1
0.5
0.7
0.8
0.9
1.0
1.1
1.2
1.3
T
J
=25
O
C
Pulse Width=300ms
1% Duty Cycle
8
4
2
60Hz RESISTIVE OR
INDUCTIVE LOAD
MOUNTED ON 4x4 INCH
COPPER PC BOARD T
A
0.5
,,
(12.7mm) LEAD LENGTHS
0
0
50
100
150
TEMPERATURE,
O
C
INSTANTANEOUS FORWARD VOLTAGE
FIG. 2-TYPICAL INSTANTANEOUS FORWARD
CHATACTERISTICS PER ELECMENT
FIG. 1-DERATING CURVE FOR OUTPUT RECTIFIED CURRENT
INSTANEOUS REVERSE, CURRENT(A)
10
300
PEAK FORWARD SURGE
CURRENT AMPERES
T
J
=100 C
O
250
SINGLE SINE-WAVE
JEDEC METHOD
T
J
=150
O
C
1.0
200
150
100
50
0
0
2
5
10
0.1
T
J
=25 C
O
0.01
0
20
40
60
80
100
120 140
20
50
100
PERCENT OF PEAK
REVERSE VOLTAGE,(%)
FIG. 3-TYPICAL REVERSE CHARACTERISTISTICS
NUMBER OF CYCLES AT 60Hz
FIG. 4-MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT
JUNCTION CAPACITANCE, (pF)
400
T
J
=25 C
O
100
f=1MHz
Vsig=50m V
P-P
50
10
1
5
50
100
REVERSE VOLTAGE, VOLTS
FIG. 5-TYPICAL JUNCTJION CAPACITANCE PER ELEMENNT
STAD-JAN.29.2007
PAGE . 2
Microcontroller MCU
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