SB1045DC datasheet, PDF - EEWORLD Datasheet

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SB1045DC: DescriptionSchottky diodes; CategoryDiscrete semiconductor diode; File Size119KB，3 Pages; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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SB1045DC Overview

Schottky diodes

Features

Product Name: Schottky Diode

Product model: SB1045DC

parameter:

Repetitive reverse voltage peak Vrrm: 45V

Maximum average rectified current Io: 10A

Maximum forward surge current I FSM: 150A

Forward voltage drop VF: 0.55V when IF=5A

Maximum feedback current IR: 200uA when VR=45V

Package: TO-263/D2PAK

SB1045DC Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	PANJIT
Parts packaging code	D2PAK
package instruction	ROHS COMPLIANT, PLASTIC, TO-263, D2PAK-3
Contacts	4
Reach Compliance Code	_compli
ECCN code	EAR99
Other features	FREE WHEELING DIODE, LOW POWER LOSS
application	EFFICIENCY
Shell connection	CATHODE
Configuration	COMMON CATHODE, 2 ELEMENTS
Diode component materials	SILICON
Diode type	RECTIFIER DIODE
Maximum forward voltage (VF)	0.55 V
JEDEC-95 code	TO-263AB
JESD-30 code	R-PSSO-G2
Maximum non-repetitive peak forward current	150 A
Number of components	2
Phase	1
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Maximum output current	5 A
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Maximum repetitive peak reverse voltage	45 V
surface mount	YES
technology	SCHOTTKY
Terminal form	GULL WING
Terminal location	SINGLE
Maximum time at peak reflow temperature	NOT SPECIFIED

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SB1020DC~SB1060DC

SCHOTTKY BARRIER RECTIFIERS

VOLTAGE

FEATURES

• Plastic package has Underwriters Laboratory

Flammability Classification 94V-O.

Flame Retardant Epoxy Molding Compound.

• Exceeds environmental standards of MIL-S-19500/228

• Low power loss, high efficiency.

• Low forwrd voltge, high current capability

• High surge capacity.

• For use in low voltage,high frequency inverters

free wheeling , and polarlity protection applications.

• In compliance with EU RoHS 2002/95/EC directives

20 to 60 Volts

CURRENT

10 Amperes

MECHANICALDATA

• Case: TO-263 Molded plastic

• Terminals: Solder plated, solderable per MIL-STD-750, Method 2026

• Polarity: As marked.

• Standard packaging: Any

• Weight: 0.0514 ounces, 1.46 grams.

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.

For capacitive load, derate current by 20%

PA RA M E TE R

M a xi m um R e c ur r e nt P e a k R e ve r s e V o l t a g e

M a xi m um R M S V o l t a g e

M a xi m um D C B l o c k i ng V o l t a g e

M a xi m um A ve r a g e F o r w a r d C ur r e nt a t T

= 7 5

P e a k F o r w a r d S ur g e C ur r e nt : 8 . 3 m s s i ng l e ha l f s i ne - w a ve

s up e r i m p o s e d o n r a t e d l o a d ( J E D E C m e t ho d )

M a xi m um F o r w a r d V o l t a g e a t 5 A ,

M a xi m um D C R e ve r s e C ur r e nt a t T

= 2 5

R a t e d D C B l o c k i ng Vo l t a g e T

= 1 0 0

Ty p i c a l T h e r m a l R e s i s t a n c e

O p e r a t i n g J u n c t i o n Te m p e r a t u r e R a n g e

S t o r a g e Te m p e r a t u r e R a n g e

S YM B O L

RRM

RMS

D C

F ( A V )

F S M

J C

S TG

SB1020DC SB1030DC SB1040DC SB1045DC SB1050DC SB1060DC

U N IT S

150

0 .5 5

3 1 .5

0 .7 5

0 .1

3 .0

0 .2

C / W

-5 5 to +1 2 5

-5 5 to +1 5 0

Note.

Both Bonding and Chip structure are available.

STAD-APR.27.2009

PAGE . 1

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