SA7454
2×6W AUDIO POWER AMPLIFIER
DESCRIPTION
SA7454 is a Class AB dual audio power amplifier. It adopts HSIP-9 or
DIP-18IH-300-2.54 package.
FEATURES
* High output power: 6 + 6W @ THD=10%, R
L
=4Ω,V
CC
=14.4V
* Fixed gain
* Good power supply ripple rejection
* Standby and Mute functions
* Low ON/OFF POPO noise
* Few external components
* Short circuit protection
* Inverting polarity protection
* Thermal protection
ORDERING INFORMATION
Device
SA7454
SA7454H
Package
DIP-18IH-300-2.54
HSIP-9
APPLICATIONS
* Multimedia system
* LCD-TV
BLOCK DIAGRAM
HANGZHOU SILAN MICROELECTRONICS CO.,LTD
Http://www.silan.com.cn
REV:1.0
2008.10.21
Page 1 of 5
SA7454
ABSOLUTE MAXIMUM RATINGS
Characteristics
Power Supply
Max. Voltage of Inverting Polarity
Output Pin Endurance Capability
Output Peak Current
Total Power Dissipation
Storage Temperature
Operating Ambient Temperature
Junction Temperature
Thermal Resistance from
Junction to Case
Symbol
V
s
V
s(r)
ERGo
I
osm
I
orm
P
tot
T
stg
T
amb
T
j
R
th(j-c)
SA7454H
SA7454
V
s
=0V
No repeat
Repeat
Conditions
Operating state
No signal
Rating
18
20
6
200
4
2.5
15
-55~+150
-40~+85
+150
8
15
Unit
V
V
mJ
A
W
°C
°C
°C
°C/W
ELECTRICAL CHARACTERISTICS
(Unless otherwise specified, V
s
=14.4V; R
L
=4Ω; f=1KHz; T
amb
=25°C)
Characteristics
Power Supply
Total Quiescent Current
Output DC Level
Output Power
Total Harmonic Distortion
Low Cut-Off Frequency
High Cut-Off Frequency
Closed Loop Gain
Supply Voltage Ripple Rejection
Ratio
Input Resistance
Output Noise
Channel Separation
Channel Balance
Thermal Protection
Mute Function
Mute/Play Threshold
Output DC Level When Mute
Stand-By Function
Stand-By/Mute Threshold
Stand-By Quiescent Current
Stand-By Bias Current
VT
ST-BY
Iq
ST-BY
Ib
ST-BY
0
--
--
--
3.0
15
2.0
100
40
V
μA
μA
VT
MUTE
V
o
3.3
--
--
--
6.4
2
V
mV
Symbol
V
s
I
q
V
o
P
o
THD
flr
fhr
Gv
Operating
SV
RR
Zi
Operating, Rs=0Ω
V
no
CS
CB
Tp
Operating, Rs=10Ω
Mute
Rs=0Ω
Mute
Stand-by
THD=0.5%
THD=10%
Po=1W
-3dB
-1dB
Test conditions
Min.
8.5
--
--
4
5.5
--
--
20
19
48
48
80
50
--
--
--
40
--
Typ.
14.4
40
7.00
4.7
6.0
0.1
45
--
20
--
--
--
60
50
70
50
--
0.1
150
Max.
18.0
80
--
--
--
--
--
--
21
--
--
--
75
--
100
--
--
1
dB
dB
°C
μV
kΩ
dB
Unit
V
mA
V
W
%
Hz
kHz
dB
HANGZHOU SILAN MICROELECTRONICS CO.,LTD
Http://www.silan.com.cn
REV:1.0
2008.10.21
Page 2 of 5
SA7454
PIN CONFIGURATION
IN2
MUTE/STBY
V
CC
OUT2
PGND
OUT1
SVR
SGND
IN1
PIN DESCRIPTIONS
Pin No.
1
2
3
4
5
6
7
8
9
Pin Name
IN1
SGND
SVR
OUT1
PGND
OUT2
V
CC
MUTE/STBY
IN2
I/O
I
--
O
O
--
O
--
I
I
Non inverting input 1
Signal ground
Supply voltage ripple rejection pin
Output 1
Power ground
Output 2
Power supply
Standby and mute pin
Non inverting input 2
Pin Description
FUNCTION DESCRIPTION
Stand-by and mute function
The MUTE/STBY controls the amplifier state by different voltages.
When MUTE/STBY is 0 -2V, the amplifier is in standby mode, and the circuit is in power down mode;
When MUTE/STBY is 3.3 -6.4V, the amplifier is in mute mode;
When MUTE/STBY is higher than 8.5V, the amplifier is in operating mode.
Power Dissipation and Heat Sinking
When the load is a resistor, the maximum average power that SA7454 will be required to dissipate is
approximately:
2 2
PD(MAX)=Vs /π RL+PQ
Where Vs is the power supply, RL is the load resistance, PQ is the quiescent power dissipation. The above
equation is only an approximation which assume SA7454 an “ideal” class B output stage and power dissipation in
all other parts of the circuit is constant. As an example, if the SA7454 is operated on a 14.4V power supply with a
resistive load of 4Ω, it can develop up to 6W of internal power dissipation. If the die temperature is to remain
below 150°C for ambient temperatures up to 50°C, the total junction-to-ambient thermal resistance must be less
HANGZHOU SILAN MICROELECTRONICS CO.,LTD
Http://www.silan.com.cn
REV:1.0
2008.10.21
Page 3 of 5
SA7454
than:
(150°C－50°C)/6W＝16.7°C/W
For HSIP-9 package, the die-to-package thermal resistance is Rth(j-c) = 8°C/W，then the package-to-ambient
thermal resistance should be lower than 8.7°C/W. So we need heat sink to reduce the package-to-ambient
thermal resistance.
For DIP-18IH-300-2.54 package, the die-to-package thermal resistance is Rth(j-c) = 15°C/W
，
then the
package-to-ambient thermal resistance should be lower than 1.7°C/W，that will make heat sinking difficult, in
addition, DIP-18IH-300-2.54 can not add effective heat sink, so we need to reduce the power dissipation by
reducing load. For example, with a 8Ω load, it can develop up to 3W of internal power dissipation, and the
package-to-ambient thermal resistance should be lower than:
(150°C－50°C)/3W－15°C/W＝18.3°C /W
The thermal requirements can become more difficult when SA7454 is driving a reactive load. As a general rule,
the power dissipation of an amplifier driving a 60º reactive load (usually considered to be a worst-case
loudspeaker load) will be roughly that of the same amplifier driving the resistive part of that load. For example, a
loudspeaker may at some frequency have an impedance with a magnitude of 8Ω and a phase angle of 60º. The
real part of this load will then be 4Ω, and the amplifier power dissipation equal to the power dissipation with a 4Ω
load.
TYPICAL APPLICATION CIRCUIT
HANGZHOU SILAN MICROELECTRONICS CO.,LTD
Http://www.silan.com.cn
REV:1.0
2008.10.21
Page 4 of 5
SA7454
PACKAGE OUTLINE
HSIP-9
Unit: mm
DIP-18IH-300-2.54
Unit: mm
Note: Silan reserves the right to make changes without notice in this specification for the improvement of the design and performance.
Silan will supply the best possible product for customers.
HANGZHOU SILAN MICROELECTRONICS CO.,LTD
Http://www.silan.com.cn
REV:1.0
2008.10.21
Page 5 of 5
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