PDZ33B-AU_R2_000A1 datasheet, PDF

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PDZ33B-AU_R2_000A1: DescriptionZener Diode,; CategoryDiscrete semiconductor diode; File Size162KB，6 Pages; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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PDZ33B-AU_R2_000A1 Overview

Zener Diode,

PDZ33B-AU_R2_000A1 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	PANJIT
package instruction	R-PDSO-F2
Reach Compliance Code	compliant
ECCN code	EAR99
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
Maximum dynamic impedance	40 Ω
JESD-30 code	R-PDSO-F2
Maximum knee impedance	250 Ω
Number of components	1
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
polarity	UNIDIRECTIONAL
Maximum power dissipation	0.4 W
Guideline	AEC-Q101
Nominal reference voltage	33 V
Maximum reverse current	0.05 µA
Reverse test voltage	25 V
surface mount	NO
technology	ZENER
Terminal form	FLAT
Terminal location	DUAL
Maximum voltage tolerance	2.57%
Working test current	5 mA

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PDZ4.7B-AU ~ PDZ36B-AU

SURFACE MOUNT SILICON ZENER DIODES

VOLTAGE

4.7 to 36 Volt

POWER

400 mWatt

FEATURES

• Planar Die construction

• 400mW Power Dissipation

• Ideally Suited for Automated Assembly Processes

• Acquire quality system certificate : TS16949

• AEC-Q101 qualified

• Lead free in compliance with EU RoHS 2011/65/EU directive

• Green molding compound as per IEC61249 Std. . (Halogen Free)

0.107(2.7)

0.090(2.3)

0.012(0.30)MIN.

0.006(0.15)

0.002(0.05)

0.054(1.35)

0.045(1.15)

0.014(0.35)

0.009(0.25)

0.036(0.90)

0.027(0.70)

0.078(1.95)

0.068(1.75)

MECHANICAL DATA

• Case: SOD-323, Molded Plastic

• Terminals: Solderable per MIL-STD-750, Method 2026

• Appox Weight: 0.00014 ounces, 0.0041 grams

Cathode

Anode

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

PARAMETER

Maximum Power Dissipation (Note A) at 25

Operating Junction and Storage Temperature Range

Thermal Resistance, Junction to Ambient (Note B)

SYMBOL

θJA

LIMITS

400

-55 to + 150

650

UNIT

C/W

NOTE :

A.Mounted on 5mm

(0.013mm thick) land areas

B.Mounted on a FR4 PCB, single-sided copper, mini pad.

May 18,2016-REV.01

PAGE . 1

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