MM3Z5250B datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > MM3Z5250B

Preview

MM3Z5250B: DescriptionSilicon Planar Zener Diodes; File Size112KB，4 Pages; ManufacturerNanjing International Group Co.,Ltd

Download Datasheet View All

MM3Z5250B Overview

Silicon Planar Zener Diodes

MM3Z5250B Preview

Download Datasheet

View All

MM3Z5221B~MM3Z5267B

Silicon Planar Zener Diodes

PINNING

Features

• Total power dissipation: Max. 300 mW

• Small plastic package suitable for

surface mounted design

• Tolerance approximately ± 5%

DESCRIPTION

Cathode

Anode

Top View

Simplified outline SOD-323 and symbol

Absolute Maximum Ratings (T

= 25

Parameter

Power Dissipation

Junction Temperature

Storage Temperature Range

Symbol

tot

stg

Value

300

150

- 55 to + 150

Unit

Characteristics at T

= 25

Parameter

Thermal Resistance Junction to Ambient Air

Forward Voltage

at I

= 10 mA

Symbol

θJA

Max.

417

0.9

Unit

C/W

Recommended Resources

RTS0031U/RTS0031UM circuit

MB3722 power amplifier circuit diagram

Common mode interference suppression circuit

Ordinary European SMS Telephone (Protocol 1) Circuit

Lead-linked push-pull voltage converter

lGBT drive circuit composed of discrete components

Using a boost transistor to obtain power: We all know a principle: the power output by a transistor varies with the output voltage. The higher the voltage, the greater the power .The transistor works by the movement of carriers. Taking the np...; Jacktang Analogue and Mixed Signal

IoT data card system source code - IoT technology architecture diagram: As a system network, the Internet of Things, like other networks, also has its own unique internal architecture. Do you know how many layers the architecture of the Internet of Things is divided into?...; 火辣西米秀 RF/Wirelessly

What do the three color rings on the TOP SOLDER layer mean from inside to outside?: What do the three color rings (1), (2), and (3) on the TOP SOLDER layer of a PAD (as shown in the figure below) mean? Isn't the solder layer used to make steel mesh? Isn't one color ring enough? Why d...; 一沙一世 stm32/stm8

How to choose TVS tube for MSP430FR2633 touch chip: TI's touch chip MSP430FR2633 touch solution can support proximity sensing. Generally, the proximity sensing PCB Sensor will be placed close to the machine casing. Antistatic testing will be performed ...; fish001 Microcontroller MCU

IMX6ULL development board Ubuntu common commands (Part 2): Common Ubuntu commands for IMX6ULL development board (Part 2) - Based on Xunwei-i.MX6ULL Terminator development board2.5.10 View file content command cat"cat" is a text output command under the Linux ...; 马佳徐徐 Embedded System

Let’s talk about the analysis of common terms in PCB!: When drawing a through-hole pad, the hole should be 10mil (0.2mm)larger than the pin , and the outer diameter should be more than 20mil larger than the hole, otherwise the pad is too small and it is v...; 造物工场PCB PCB Design

Popular Components