MM32L073TW datasheet, PDF - EEWORLD Datasheet

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MM32L073TW: DescriptionWorking voltage: 2V ~ 5.5V CPU digits: 32 CPU core: ARM® Cortex®-M0 Main frequency (MAX): 48MHz ROM type: FLASH; CategoryThe embedded processor and controller; File Size2MB，67 Pages; ManufacturerMindMotion; Websitehttp://www.mindmotion.com.cn/; Lingdong Microelectronics Co., Ltd. (stock code: 833448, stock name: Lingdong Microelectronics) is a leading supplier of MCU products and MCU application solutions in China. It is an integrated circuit design enterprise recognized by the Ministry of Industry and Information Technology of China and the Shanghai Information Office, and is also a high-tech enterprise recognized by Shanghai. Since its establishment in March 2011, Lingdong Microelectronics has successfully completed the design and promotion of hundreds of MCU products. Lingdong Microelectronics' MCU products based on ARM Cortex-M0 and Cortex-M3 cores currently in batches include: MM32F series for general high-performance market, MM32L series for ultra-low power consumption and security applications, MM32W series with multiple wireless connection functions, MM32SPIN series for motor drive and control, and OTP-type MM32P series, etc., to meet the needs of customers and the market for rich application scenarios in multiple fields and at multiple levels.

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MM32L073TW Overview

Working voltage: 2V ~ 5.5V CPU digits: 32 CPU core: ARM® Cortex®-M0 Main frequency (MAX): 48MHz ROM type: FLASH

MM32L073TW Parametric

Parameter Name	Attribute value
Extra features	-
UART/USART	1 UART
SPI	1
USB Device	1
PWM	4
USB Host/OTG	-
LCD	-
I2C（SMBUS/PMBUS）	1
Operating Voltage	2V ~ 5.5V
Ethernet	-
EEPROM size	-
CAN	1
A/D	1 x 12bit
D/A	-
CPU bits	32
CPU core	ARM® Cortex®-M0
ROM size	128KB
RAM size	8KB
Main frequency (MAX)	48MHz
ROM type	FLASH
Number of I/Os	16

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数据手册

Datasheet

MM32L0xx

ARM Cortex M0

2.13_n

保留不通知的情况下，更改相关资料的权利

5.1.7

5.2

5.3

电流消耗测量

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

绝对最大额定值

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

工½条件

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

5.3.1

5.3.2

5.3.3

5.3.4

5.3.5

5.3.6

5.3.7

5.3.8

5.3.9

通用工½条件

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27

上电和掉电时的工½条件

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

内嵌复½和电源控制模块特性

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28

供电电流特性

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

外部时钟源特性

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31

内部时钟源特性

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

PLL

特性

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

存储器特性

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

EMC

特性

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

5.3.10

绝对最大值

(电气敏感性) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

5.3.11 I/O

端口特性

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

5.3.12 NRST

引脚特性

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40

5.3.13 TIM

定时器特性

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

5.3.14

通信接口

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41

5.3.15 CAN(控制器局域½络)

接口

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

5.3.16 12

ADC

特性

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

5.3.17

温度传感器特性

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

5.3.18

比较器特性

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

封装特性

6.1

6.2

6.3

6.4

封装

LQFP48 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52

封装

LQFP32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

封装

QFN32 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56

封装

TSSOP20 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

型号½名

修改记½

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