MBR10150F datasheet, PDF - EEWORLD Datasheet

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MBR10150F: DescriptionSchottky diodes; CategoryDiscrete semiconductor diode; File Size91KB，2 Pages; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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MBR10150F Overview

Schottky diodes

Features

Product Name: Schottky Diode

Product model: MBR10150F

parameter:

Repetitive reverse voltage peak Vrrm: 150V

Maximum average rectified current Io: 10A

Maximum forward surge current I FSM: 150A

Forward voltage drop VF: 0.9V when IF=10A

Maximum feedback current IR: 50uA when VR=150V

Package: ITO-220AC

MBR10150F Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	PANJIT
Parts packaging code	TO-220AC
package instruction	ROHS COMPLIANT, PLASTIC, ITO-220AC, 2 PIN
Contacts	3
Reach Compliance Code	_compli
ECCN code	EAR99
Other features	FREE WHEELING DIODE, LOW POWER LOSS
application	EFFICIENCY
Shell connection	ISOLATED
Configuration	SINGLE
Diode component materials	SILICON
Diode type	RECTIFIER DIODE
JEDEC-95 code	TO-220AC
JESD-30 code	R-PSFM-T2
Maximum non-repetitive peak forward current	150 A
Number of components	1
Phase	1
Number of terminals	2
Maximum operating temperature	175 °C
Minimum operating temperature	-65 °C
Maximum output current	10 A
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	FLANGE MOUNT
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Maximum repetitive peak reverse voltage	150 V
surface mount	NO
technology	SCHOTTKY
Terminal form	THROUGH-HOLE
Terminal location	SINGLE
Maximum time at peak reflow temperature	NOT SPECIFIED

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MBR1040F~MBR10200F

10 AMPERES SCHOTTKY BARRIER RECTIFIERS

VOLTAGE

40 to 200 Volts

CURRENT

10 Amperes

FEATURES

• Plastic package has Underwriters Laboratory

Flammability Classification 94V-O.

Flame Retardant Epoxy Molding Compound.

• Metal silicon junction, majority carrier conduction

• Low power loss, high efficiency.

• High current capability

• Guardring for overvlotage protection

• For use in low voltage,high frequency inverters

free wheeling , and polarlity protection applications.

• In compliance with EU RoHS 2002/95/EC directives

MECHANICALDATA

• Case: ITO-220AC molded plastic

• Terminals: solder plated, solderable per MIL-STD-750, Method 2026

• Polarity: As marked.

• Mounting Position: Any

• Weight: 0.055 ounces, 1.5615 grams.

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25°C ambient temperature unless otherwise specified. Single phase, half wave, 60 Hz, resistive or inductive load.

For capacitive load, derate current by 20%

PA RA M E TE R

M a xi m um R e c ur r e nt P e a k R e ve r s e V o l t a g e

M a xi m um R M S V o l t a g e

M a xi m um D C B l o c k i ng V o l t a g e

M a xi m um A ve r a g e F o r w a r d C ur r e nt ( S e e

fi g .1 )

P e a k F o r w a r d S ur g e C ur r e nt : 8 . 3 m s s i ng l e

ha l f s i ne - w a ve s up e r i m p o s e d o n r a t e d

l o a d ( J E D E C m e t ho d )

M a xi m um F o r w a r d V o l t a g e a t 1 0 A , p e r l e g

M a xi m um D C R e ve r s e C ur r e nt T

= 2 5

a t R a t e d D C B l o c k i ng V o l t a g e T

= 1 2 5

Ty p i c a l T h e r m a l R e s i s t a n c e

O p e r a t i ng a nd S t o r a g e J unc t i o n

Te m p e r a t u r e R a n g e

S YM B O L

RRM

RMS

F (AV )

MB R1 0 4 0 F

MB R1 0 4 5 F MB R1 0 5 0 F MB R1 0 6 0 F MB R1 0 8 0 F MB R1 0 9 0 F MB R1 0 1 0 0 F MB R1 0 1 5 0 F MB R1 0 2 0 0 F

U N IT S

3 1 .5

100

150

105

150

200

140

200

F S M

150

0 .7

0 .7 5

0 .0 5

3 .0

0 .8

0.9

J C

, T

S TG

-5 5 to + 1 5 0

C /

-6 5 to + 1 7 5

Notes :

Both Bonding and Chip structure are available.

STAD-APR.30.2009

PAGE . 1

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