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MB54AT/R7

Description
Rectifier Diode, Schottky, 1 Phase, 1 Element, 5A, 45V V(RRM), Silicon, DO-214AB, ROHS COMPLIANT, PLASTIC, SMC, 2 PIN
CategoryDiscrete semiconductor    diode   
File Size108KB,4 Pages
ManufacturerPANJIT
Websitehttp://www.panjit.com.tw/
Environmental Compliance

PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values ​​include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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MB54AT/R7 Overview

Rectifier Diode, Schottky, 1 Phase, 1 Element, 5A, 45V V(RRM), Silicon, DO-214AB, ROHS COMPLIANT, PLASTIC, SMC, 2 PIN

MB54AT/R7 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerPANJIT
Parts packaging codeDO-214AB
package instructionROHS COMPLIANT, PLASTIC, SMC, 2 PIN
Contacts2
Reach Compliance Codecompliant
ECCN codeEAR99
Other featuresFREE WHEELING DIODE, LOW POWER LOSS
applicationEFFICIENCY
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeRECTIFIER DIODE
JEDEC-95 codeDO-214AB
JESD-30 codeR-PDSO-C2
Maximum non-repetitive peak forward current100 A
Number of components1
Phase1
Number of terminals2
Maximum operating temperature175 °C
Minimum operating temperature-65 °C
Maximum output current5 A
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
Maximum repetitive peak reverse voltage45 V
surface mountYES
technologySCHOTTKY
Terminal formC BEND
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED

MB54AT/R7 Preview

Download Datasheet
MB54~MB520
SURFACE MOUNT SCHOTTKY BARRIER RECTIFIER
VOLTAGE
FEATURES
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-O
• For surface mounted applications
• Low profile package
• Built-in strain relief
• Metal to silicon rectifier. majority carrier conduction
• Low power loss,high efficiency
• High surge capacity
• For use in low voltage high frequency inverters, free wheeling,
and polarity protection applications
Lead free in comply with EU RoHS 2002/95/EC directives
40 to 200 Volts
CURRENT
5.0 Amperes
MECHANICAL DATA
• Case: JEDEC DO-214AB molded plastic
• Terminals:Solder plated, solderable per MIL-STD-750, Method 2026
• Polarity: Color band denotes positive end (cathode)
• Standard packaging: 16mm tape (EIA-481)
• Weight: 0.0082 ounce, 0.2325 gram
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25°C ambient temperature unless otherwise specified. Resistive or inductive load.
PA RA M E TE R
M a xi m um R e c ur r e nt P e a k R e ve r s e V o l t a g e
M a xi m um R M S V o l t a g e
M a xi m um D C B l o c k i ng V o l t a g e
A ve r a g e R e c t i f i e d O ut p ut C ur r e nt
( S e e F i g ur e 1 )
N o n- R e p e t i t i ve P e a k F o r w a r d S ur g e C ur r e nt : 8 . 3 m s
s i ng l e ha l f s i ne - w a ve s up e r i m p o s e d o n r a t e d l o a d
F o rwa rd Vo lta g e a t 5 .0 A (No te 1 )
P e a k R e ve r s e C ur r e nt T
J
= 2 5
O
C
a t R a t e d D C B l o c k i ng Vo l t a g e T
J
= 1 0 0
O
C
Ty p i c a l T h e r m a l R e s i s t a n c e ( N o t e 2 )
O p e r a t i n g J u n c t i o n a n d S t o r a g e Te m p e r a t u r e R a n g e
S YM B O L
V
RRM
V
RMS
V
D C
I
F ( A V )
I
F S M
V
F
I
R
R
θ
J A
R
θ
J L
T
J
, T
S TG
MB 54
MB 54A
MB 55
MB 56
MB 58
MB 59
MB 510
MB 515
MB 520
U N IT S
V
V
V
A
A
40
28
40
45
3 1 .5
45
50
35
50
60
42
60
80
56
80
5 .0
100
90
63
90
100
70
100
150
105
150
200
140
200
0 .7 0
0 .7 4
0 .0 5
10
17
55
0 .8 0
0.9
V
mA
O
C /
W
C
-5 5 to +1 5 0
-6 5 to +1 7 5
O
NOTES:
1. Pulse Test with PW =300µsec, 1% Duty Cycle.
2. Mounted on P.C. Board with 14mm
2
(.013mm thick) copper pad areas.
STAD-APR.09.2009
PAGE . 1
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