PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.
As the title says, after using AD software to design a board with multiple schematics corresponding to one PCB, how can I compare the differences between the schematics and the PCB? I only know how to...
Matlab Simulink communication system simulation : https://training.eeworld.com.cn/course/67739?Detailed explanation of MATLAB Simulink communication system modeling and simulation (Liu Xueyong) video ...
I have been a member of EEWorld for several years now, and I have a lot of feelings: There are many activities in the EEWorld community, which are very helpful to engineers. Through various activities...
Power management for electrical devices is relatively simple: just turn on and off. But with computers, especially those running Windows , things get more complicated. On is still on, of course. But f...
[i=s] This post was last edited by Lan Yuye on 2018-9-5 10:56 [/i] GD350 development board connects to cloud platform via WIFI Purpose: Expand sensors through GD350 development board, read parameters ...
[color=#333333]This is my first time posting for help on eeworld. Please give me some advice! I will correct any problems with the formatting of the question! ! [/color] [color=#333333]Background: [/c...
The latest news shows that the source code of 50 companies including Microsoft, Adobe, Lenovo, AMD, Qualcomm, MediaTek, General Electric, Nintendo, Disney, and Huawei HiSilicon has been leaked online...[Details]
The phase profile imprinted by a spatial light modulator (SLM) and the resulting light intensity profile in the capture plane. Image source: Physicist Organization Network Want to know if a very ...[Details]
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On October 15, the world's largest foundry manufacturer TSMC held an earnings conference today, optimistic that revenue in the fourth quarter will continue to grow; President Wei Zhejia said that TSM...[Details]
Applied Materials Releases Third Quarter Fiscal 2022 Financial Results Record quarterly revenue of $6.52 billion, up 5% year-over-year GAAP EPS of $1.85 and non-GAAP EPS of $1.94, down 1% and up ...[Details]
SRII launches two new ALD products to meet the needs of versatility and flexibility in pan-semiconductor applications
The atomic layer deposition (ALD) process is conside...[Details]
Notable suppliers include Alps Alpine, Ambiq Micro, Amphenol LTW, HELUKABEL and Zettler Magnetics DigiKey, the world's leading commercial distributor of off-the-shelf technology components and a...[Details]
According to Dutch media De Telegraaf, the Dutch government is secretly planning an operation called "Beethoven" to retain ASML, the world's largest wafer fab equipment manufacturer. Amid concerns th...[Details]
Renesas Electronics Corporation, a global supplier of semiconductor solutions, announced that it has joined the Global Semiconductor Alliance (GSA), known as the voice of the global semiconductor ind...[Details]
Nidec Corporation (Nidec) would like to announce that it will officially establish the "Semiconductor Solutions Center" (hereinafter referred to as "the Center") on May 16. 【About the Center】 Ad...[Details]
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Intel CEO Pat Gelsinger recently said that in the AI era, Intel processors will not lose power but will continue to play an important role. Moore's Law is still valid.
Gelsinger directly att...[Details]
According to the Economic Daily, Hon Hai Group announced on January 12 that it will continue to implement the 3+3 strategy this year, which includes three future industries and three core technologie...[Details]
Schematic of stacked, twisted cuprate superconductors. Image source: Physicist Organization Network Superconductors have been a hot topic in physics for decades. But these materials, which allow pe...[Details]
In September of this year, Intel announced the first glass substrate for next-generation advanced packaging, and plans to provide complete solutions to the market in the next few years, allowing the ...[Details]