=25°C) ..................................................................................................................................... 1.2 W
Total Power Dissipation
2
(Printed circuit board 2mm thick, collector plating 1cm square or larger).......................................................................... 1.6 W
•
Maximum Voltages and Currents
BV
CBO
Collector to Base Voltage......................................................................................................................................... 100 V
BV
CEO
Collector to Emitter Voltage ..................................................................................................................................... 100 V
BV
EBO
Emitter to Base Voltage ............................................................................................................................................... 5 V
I
C
Collector Current (Continue)............................................................................................................................................... 4 A
I
C
Collector Current (Peak) ..................................................................................................................................................... 6 A
Thermal Characteristic
Symbol
R
θ
ja
Characteristic
Thermal Resistance, junction to ambient (T
A
=25 C)
o
Max.
104
Unit
o
C/W
Electrical Characteristics
(T
A
=25°C)
Symbol
BV
CBO
BV
CEO
I
CBO
I
CEO
I
EBO
*V
CE(sat)
*V
BE(on)
*h
FE1
*h
FE2
Cob
Min.
100
100
-
-
-
-
-
1
500
-
Typ.
-
-
-
-
-
-
-
-
-
-
Max.
-
-
1
2
2
2.5
2.8
-
-
200
pF
Unit
V
V
mA
mA
mA
V
V
K
I
C
=1mA
I
C
=30mA
V
CB
=100V
V
CE
=50V
V
EB
=5V
I
C
=2A, I
B
=8mA
I
C
=2A, V
CE
=4V
I
C
=1A, V
CE
=4V
I
C
=2A, V
CE
=4V
V
CB
=10V, f=0.1MHz
*Pulse Test: Pulse Width
≤380us,
Duty Cycle≤2%
Test Conditions
HM112
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
10000
125 C
1000
75 C
o
o
Spec. No. : HM200102
Issued Date : 2001.07.30
Revised Date : 2007.03.02
Page No. : 2/5
Current Gain & Collector Current
10000
125 C
1000
75 C
o
o
hFE
hFE
100
25 C
10
hFE @ V
CE
=4V
1
1
10
100
1000
10000
o
100
25 C
10
o
hFE @ V
CE
=3V
1
1
10
100
1000
10000
Collector Current I
C
(mA)
Collector Current I
C
(mA)
Saturation Voltage & Collector Current
10000
10000
Saturation Voltage & Collector Current
Saturation Voltage (mV)
1000
25 C
75 C
125 C
o
o
o
Saturation Voltage (mV)
1000
25 C
o
125 C
o
75 C
o
V
CE(sat)
@ I
C
=100I
B
100
100
100
100
V
CE(sat)
@ I
C
=250I
B
1000
10000
1000
10000
Collector Current I
C
(mA)
Collector Current I
C
(mA)
Saturation Voltage & Collector Current
10000
10000
ON Voltage & Collcetor Current
Saturation Voltage (mV)
25 C
1000
o
ON Voltage (mV)
25 C
1000
125 C
o
o
125 C
o
75 C
o
75 C
o
V
BE(sat)
@ I
C
=250I
B
V
BE(ON)
@ V
CE
=4V
100
100
100
100
1000
10000
1000
10000
Collector Current I
C
(mA)
Collector Current I
C
(mA)
HM112
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HM200102
Issued Date : 2001.07.30
Revised Date : 2007.03.02
Page No. : 3/5
ON Voltage & Collcetor Current
10000
Switching Time & Collector Current
10
V
CC
=30V, I
C
=250I
B1
=-250I
B2
25 C
1000
125 C
o
o
Switching Times (us)
Tstg
ON Voltage (mV)
75 C
o
1
Tf
Ton
V
BE(ON)
@ V
CE
=3V
100
100
0.1
1000
10000
1
10
Collector Current I
C
(mA)
Collector Current (A)
Capacitance & Reverse-Biased Voltage
1000
Safe Operating Area
100000
10000
Collector Current-I (mA)
C
Capacitance (pF)
1000
PT=1ms
100
PT=100ms
PT=1s
10
100
Cob
10
0.1
1
10
100
1
1
10
100
1000
Reverse-Biased Voltage (V)
Forward Voltage-V
CE
(V)
HM112
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-89 Dimension
Marking:
Spec. No. : HM200102
Issued Date : 2001.07.30
Revised Date : 2007.03.02
Page No. : 4/5
C
H
Date Code
H 1 1 2
Control Code
Pb Free Mark
Pb-Free: " "
(Note)
Normal: None
B
1
E
F
G
A
2
3
D
Note: Green label is used for pb-free packing
Pin Style: 1.Base 2.Collector 3.Emitter
J
I
Material:
•
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
•
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM
A
B
C
D
E
F
G
H
I
J
Min.
4.40
4.05
1.50
2.40
0.36
*1.50
*3.00
1.40
0.35
0.89
Max.
4.60
4.25
1.70
2.60
0.51
-
-
1.60
0.41
1.20
*: Typical, Unit: mm
3-Lead SOT-89 Plastic
Surface Mounted Package
HSMC Package Code: M
Important Notice:
•
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
•
HSMC reserves the right to make changes to its products without notice.
•
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
•
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
•
Head Office
(Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
•
Factory 1:
No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HM112
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Soldering Methods for HSMC’s Products
1. Storage environment: Temperature=10 C~35 C Humidity=65%±15%
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