PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.
based on
1. External EEPROM (if the internal flash is large enough, it can also be used)
2. RF communication
3. Host computer software (transfer upgrade files)
Summary points:
1. The program always st...
Live Replay: Microchip Security Series 15 Simplifying Security Application Design with dsPIC33/PIC24 and ATECC608 Devices : https://training.eeworld.com.cn/course/6165...
Designing Wide Input DC/DC Converters for Thermostat Applications : https://training.eeworld.com.cn/course/5267What to look for when selecting a wide input DC/DC converter for thermostat applications...
Event time: From now until July 24Event process:1. Click the "Check-in now" button below to enter the pop-up store and start the event;2. Click on the 4 check-in points in the pop-up store, follow the...
I. Overview
Continuously improving the communication capacity and quality of the communication system is the eternal theme of wireless communication. With the rapid development of wireless communicati...
STMicroelectronics Announces Outline of Plan to Target USD 20+ Billion in Revenue at Capital Markets Day
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Leverage early focus on smart mobility, power and energy management, ...[Details]
Accenture has reached an agreement to acquire XtremeEDA, an Ottawa-based leader in chip design services. The company provides semiconductor engineering services to clients seeking custom silicon solu...[Details]
According to Taiwan media Commercial Times, although the chip length and shortage problems in the electronic product supply chain have caused shipment delays and a cooling of terminal demand, the sup...[Details]
Strong demand for advanced processes drives performance growth (2020 semi-annual report financial summary): Ÿ The second quarter achieved revenue of RMB 6.27 billion, and the first half of the year...[Details]
On June 12, Japan's advanced foundry Rapidus announced earlier this month that it will expand its cooperation with IBM in the 2nm process from the front end to the back end to jointly develop chipl...[Details]
2020 is the starting point of a new decade, and we are experiencing an extraordinary spring. Intel has been rooted in China for 35 years, and its cooperation with Chinese industry partners has been t...[Details]
On November 13, according to Taiwan Economic Daily, TSMC’s CoWoS advanced packaging demand is about to explode. In addition to NVIDIA, which has confirmed to expand orders in October, heavyweight cu...[Details]
The Wall Street Journal reported on July 21 that Volkswagen's software subsidiary CARIAD has reached an agreement with STMicroelectronics to develop chips for Volkswagen's next-generation cars. The...[Details]
Thief River Falls, Minnesota, USA - DigiKey, a leading global commercial distributor of broad, fast-shipping, off-the-shelf technology components and automation products, today announced a signific...[Details]
The industry has recently expressed concerns about the stability of supply of key raw materials in the semiconductor chip industry. Currently, Russia and Ukraine supply large amounts of neon and p...[Details]
Micron Technology Inc, the largest U.S. maker of computer memory chips, said on Tuesday that the growing crisis in Ukraine is further highlighting the complexity and fragility of the semiconductor su...[Details]
On June 13, it was reported that Intel's 4 manufacturing process was only used once on the first generation of Core Ultra, codenamed Meteor Lake. Now it is the turn of Intel 3, which has been mass-...[Details]
Marvell recently announced that it will cooperate in depth with TSMC to jointly launch a 2nm chip platform suitable for data centers and artificial intelligence applications. The launch of this break...[Details]
May 17, 2023— Penn State University and onsemi, a leader in smart power and smart sensing technology , announced that they have signed a memorandum of understanding (MOU) to launch an $8 million stra...[Details]
Recently, Autodesk announced that it plans to stop using EAGLE in 2026, marking the demise of a generation of PCB artifacts. However, as an alternative, Autodesk announced that it will incorporate PC...[Details]
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Microcontroller MCU
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