ES8P5086FJSK datasheet, PDF - EEWORLD Datasheet

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ES8P5086FJSK: DescriptionSOP32, 72Kx8-bit FLASH ROM, 16K×8-bit RAM (KB), 48MHz, -40℃ ~ 85℃, 2.2V ~ 5.5V; CategoryMicro - MCU controller; File Size3MB，282 Pages; ManufacturerEastSoft; Websitehttp://www.ichaier.com/; Shanghai Neusoft Carrier Microelectronics Co., Ltd. (formerly Shanghai Haier Integrated Circuit Co., Ltd.) has been focusing on chip design for 15 years. It was acquired by Neusoft Carrier in 2015. After years of hard work, it has mastered core technologies with independent intellectual property rights and has achieved fruitful results in design process, product architecture, behavioral level description, RTL level design, verification, layout and home appliance control board design.

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ES8P5086FJSK Overview

SOP32, 72Kx8-bit FLASH ROM, 16K×8-bit RAM (KB), 48MHz, -40℃ ~ 85℃, 2.2V ~ 5.5V

ES8P5086FJSK Parametric

Parameter Name	Attribute value
Product number	ES8P5086FJSK
Encapsulation	SOP32
I/O	29
FLASH ROM	72Kx8bit
RAM(KB)	16K×8 bits
Maximum operating frequency	48MHz
Operating temperature	-40℃ ~ 85℃
Operating Voltage	2.2V ~ 5.5V
Timer 16 bit	4
Timer 32 bit	1
RTC	1
motor control	-
UART	6
IIC	1
SPI	1
IIS	-
USB	-
CAN	-
SDIO	-
Ethernet MAC10/100	-
FSMC	-
Number of digits	12
Number of channels	13
DAC	-
Operational Amplifier	-
Analog comparator	-
Internal reference voltage	YES
Touch button channel	-
LCD	-
lowest power mode	-
special function	With cyclic redundancy check CRC and data encryption/decryption AES function

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ES8P5086/ES8P5088

数据手册

MCU

ES8P5086/ES8P5088

数据手册



产品简介



数据手册

产品规格

上海东½½½波微电子有限公司

2020

年

月

日

V1.5

1/282

http://www.essemi.com

ES8P5086/ES8P5088

数据手册

目

内容目½

第

章

1. 1

1. 2

1. 3

1. 4

1. 5

第

章

2. 1

2. 2

2. 3

2. 4

2. 5

2. 6

芯片简介

................................................................................................................... 14

概述

.......................................................................................................................... 14

应用领域

................................................................................................................... 17

结构框图

................................................................................................................... 18

管脚分配图

............................................................................................................... 19

1. 4. 1 48-pin

管脚封装图

............................................................................................. 19

1. 4. 2 44-pin

管脚封装图

............................................................................................. 20

1. 4. 3 32-pin

管脚封装图

............................................................................................. 21

管脚说明

................................................................................................................... 24

1. 5. 1

管脚说明

............................................................................................................ 24

1. 5. 2

管脚对照表

........................................................................................................ 25

系统控制及操½特性

................................................................................................. 28

系统控制保护

............................................................................................................ 28

2. 1. 1

概述

................................................................................................................... 28

2. 1. 2

特殊功½寄存器

................................................................................................. 28

系统电源

................................................................................................................... 29

2. 2. 1

结构框图

............................................................................................................ 29

2. 2. 2

芯片供电电源

.................................................................................................... 29

系统复½

................................................................................................................... 29

2. 3. 1

概述

................................................................................................................... 29

2. 3. 2

结构框图

............................................................................................................ 29

2. 3. 3

复½时序图

........................................................................................................ 30

2. 3. 4

外部复½

MRSTN

参考

...................................................................................... 31

2. 3. 5

外设模块复½控制

............................................................................................. 32

2. 3. 6

特殊功½寄存器

................................................................................................. 32

½电压监测（LVD）

................................................................................................. 36

2. 4. 1

概述

................................................................................................................... 36

2. 4. 2

特殊功½寄存器

................................................................................................. 36

系统½功耗操½模式

................................................................................................. 38

2. 5. 1

概述

................................................................................................................... 38

2. 5. 2

浅睡眠模式

........................................................................................................ 38

2. 5. 3

深度睡眠模式

.................................................................................................... 38

2. 5. 4

睡眠模式的唤醒

................................................................................................. 39

2. 5. 5

睡眠模式的唤醒时间

......................................................................................... 39

2. 5. 6 FLASH

存储器等待功½

.................................................................................... 39

2. 5. 7

特殊功½寄存器

................................................................................................. 40

系统时钟

................................................................................................................... 42

2. 6. 1

概述

................................................................................................................... 42

2. 6. 2

结构框图

............................................................................................................ 43

2. 6. 3

功½说明

............................................................................................................ 43

2. 6. 3. 1

外部时钟

XTAL....................................................................................... 43

5/282

http://www.essemi.com

V1.5

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