PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.
The system's circuit board size is 4X4 cm / Adjustable high-speed sensorless BLDC circuit diagram 22.5V /55A / with undervoltage / overcurrent / high temperature protection.
The circuit diagram of thi...
/ ******************************************//* CNPF *//* CC2540 BlueTooth 4.0 Learning Example *//* Example name: Serial Communication 1 *//* Creation time: 2018/05/25 *//* Description: You can see i...
Balun was created to solve the problem of converting unbalanced ports to balanced ports. Due to the special physical structure of single-ended to differential ports, Balun becomes a special three-port...
TMS320C6678 is an 8-core DSP processor based on KeyStone architecture. The frequency of each CorePac core is up to 1.25 GHz, providing powerful fixed-point and floating-point computing capabilities. A...
A friend's company received a batch of office computers. I accompanied him to the company on the weekend to help test the machines, which actually meant turning on the computers and releasing the syst...
1. Common impedance interference of ground wire
The ground wire on the circuit diagram represents the zero potential in the circuit and is used as a common reference point for other points in the circ...
CoWoS packaging (Chip on wafer on substrate) is a 2.5D advanced packaging technology proposed by TSMC. Its main advantages are saving space, enhancing the connectivity between chips and reducing ...[Details]
Nidec Advanced Testing Technology Co., Ltd. (hereinafter referred to as "the Company") has established a subsidiary, Nidec Advanced Testing Technology (India) Private Limited, in Bangalore, Karnata...[Details]
According to news on April 17, last year, mainland China's semiconductor equipment spending accounted for about one-third of the global total.
According to data from the semiconductor industry...[Details]
A team from the Massachusetts Institute of Technology has made an important breakthrough in the field of electronic manufacturing: they used full 3D printing technology to produce active electronic...[Details]
On July 12, TrendForce published a blog post on July 10, stating that glass substrate technology has become a rising star in the field of advanced packaging due to its excellent performance and man...[Details]
Since 2016, when Ruifa Semiconductor participated in the InfoComm Beijing exhibition for the first time, it has been adding luster to this professional audio and video exhibition every year. Althou...[Details]