PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.
In recent years, with the emergence of intelligent products and increasingly fierce competition, many terminal product manufacturers have higher and higher requirements for the indicators of their own...
I started playing with digital electronics and felt that the power supply was not easy to use. I found LM317 and made a power supply module. It is simple and easy to make. If you are interested, you c...
[i=s]This post was last edited by cruelfox on 2020-4-30 00:46[/i] I have been playing with the Cortex-A7 core of the STM32MP157A because it is new to me. In addition to the two A7 cores, this chip is...
About HYT
HYC Technology (HYC for short) was founded in Shenzhen, China in 2000 and moved to Qingyuan, Guangdong in 2014. It is now headquartered in Qingyuan and has branches in Shenzhen and Wuhan. HY...
Since its birth, the semiconductor industry has gone through three generations of material changes. The third generation of semiconductor materials are mainly wide bandgap (bandgap width Eg 2.3eV) s...[Details]
January 16, 2023, Shanghai, China – On January 12, 2023, the WIM Innovators Annual Conference was successfully held. At the meeting, Yiou United Chip List released the 2022 semiconductor series list....[Details]
The AI 100-Model War is raging, and many companies have just made money in the field of large models. NVIDIA is relying on it to soar in the stock market, with its market value exceeding US$1.2 ...[Details]
On the morning of June 30, Samsung Electronics announced that initial production of chips based on the 3nm Gate-All-AroundT (GAA) process node has begun. Samsung Electronics’ first GAA “Multi-Brid...[Details]
On December 29, according to LTN reports, TSMC plans to build new 2nm wafer factories in Hsinchu Science Park and Kaohsiung Nanzi Park. It is reported that TSMC plans to build 5 new wafer fabs in Kao...[Details]
Major iPhone assembler Foxconn said on Monday it plans to build a chip factory in a joint venture with Indian natural resources group Vedanta, making the Taiwanese company the first major foreign tec...[Details]
On May 17, STMicroelectronics (ST)'s price increase letter leaked again. The notice showed that ST will increase prices for its entire product line starting June 1. Price increase letter content:...[Details]
The European Commission has proposed the latest goal of digital transformation: by 2030, the total production value of Europe's advanced and sustainable semiconductors will account for at least 20% o...[Details]
According to EETimes, UK-based IP supplier UltraSoC recently announced that it has received a new round of financing of 5 million pounds. The funds will be used to develop hardware-level network secu...[Details]
AMSL has rejected the United States. According to US media CNBC, the United States is lobbying the Dutch government to ban ASML from selling some photolithography machines to China, but ASML has r...[Details]
Jiwei.com reported (Text/Chen Xinghua) Recently, the 2023 General Electronics Technology Seminar was successfully held at the Kerry Hotel in Pudong, Shanghai. With the theme of "Innovation and Core C...[Details]
According to news on October 16, Micron Technology Co., Ltd. announced that it has ushered in a historic day. In celebration of Micron’s 45th anniversary, its new cutting-edge assembly and test facto...[Details]
In the four trading days last week, the market value and stock prices of mainland semiconductor companies listed in Hong Kong continued to soar, led by SMIC, setting off a single-day increase war. SM...[Details]
Recently, during the third Dishui Lake China RISC-V Industry Forum, Dai Weimin, chairman of the China RISC-V Industry Alliance and founder, chairman and president of VeriSilicon, said that there are ...[Details]
Applied Materials Expands 2D EUV Logic Scaling with Stensar™ CVD Instead of Spin-On Coating
Preview of the broadest portfolio of 3D gate-all-around transistor technologies, includ...[Details]
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