Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.
Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube
Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)
Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.
ESD protection diode
Features
Product Name: ESD Protection Diode
Product model: CESDLC3V0J4
Product Description:
The CESDLC3V0J4 is designed to protect voltage sensitive components
from ESD. Excellent clamping capability, low leakage, and fast response
time provide best in class protection on designs that are exposed to ESD.
Because of its small size, it is suited for use in cellular phones, MP3 players,
digital cameras and many other portable applications where board space is
at a premium.
Product Features:
Four Separate Unidirectional Configurations for Protection
Low Leakage Current <1μA @ 3 Volts
Small Package
Low Capacitance
Complies to USB 1.1 Low Speed & Full Speed Specifications
These are Pb-Free Devices
Product parameters:
Pd dissipated power: 150mW
Vrwm reverse working peak voltage: 3V
V(BR) Breakdown voltage: Min=5.3V Max=5.9V
IR maximum reverse leakage current: 1uA
IT test current: 1mA
VC clamping voltage: 8.3V
IPP reverse pulse current peak: 1.6A
C Capacitance: 9pF
Package: SOT-353
XuanTie RISC-V Activity Zone
Domestic Chip Exchange
Motor Drive Control（Motor Control）
Real-time operating system RTOS
stm32/stm8
Discrete Device
Popular Components
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
京公网安备 11010802033920号
EEWORLD
