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C1815GR

Description
Transistor
CategoryDiscrete semiconductor    The transistor   
File Size110KB,2 Pages
ManufacturerJCET
Websitehttp://www.cj-elec.com/

Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); ​​QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

 

 

Download Datasheet Parametric View All

C1815GR Overview

Transistor

C1815GR Parametric

Parameter NameAttribute value
MakerJCET
Reach Compliance Codeunknown
Maximum collector current (IC)0.15 A
ConfigurationSingle
Minimum DC current gain (hFE)200
Maximum operating temperature150 °C
Polarity/channel typeNPN
Maximum power dissipation(Abs)0.4 W
surface mountNO
Nominal transition frequency (fT)80 MHz

C1815GR Preview

Download Datasheet
JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO.,LTD
TO-92 Plastic-Encapsulate Transistors
C1815
FEATURES
Power dissipation
MAXIMUM RATINGS* T
A
=25℃ unless otherwise noted
Symbol
V
CBO
V
CEO
V
EBO
I
C
P
D
T
J
, T
stg
Parameter
Collector-Base Voltage
Collector-Emitter Voltage
Emitter-Base Voltage
Collector Current -Continuous
Total Device Dissipation
Junction and Storage Temperature
Value
60
50
5
150
400
-55-150
Units
V
V
V
mA
mW
3.BASE
TRANSISTOR (NPN)
TO—92
1.EMITTER
2.COLLECTOR
1 2 3
*These ratings are limiting values above which the serviceability
of any semiconductor device may be impaired.
ELECTRICAL CHARACTERISTICS(Tamb=25℃
Parameter
Collector-base breakdown voltage
Collector-emitter breakdown voltage
Emitter-base breakdown voltage
Collector cut-off current
Collector cut-off current
Emitter cut-off current
DC current gain
Collector-emitter saturation voltage
Base-emitter saturation voltage
Transition frequency
Collector Output Capacitance
Noise Figure
Symbol
V(BR)
CBO
V(BR)
CEO
V(BR)
EBO
I
CBO
I
CEO
I
EBO
h
FE(1)
V
CE
(sat)
V
BE
(sat)
f
T
Cob
NF
unless
Test
otherwise
specified)
TYP
MAX
UNIT
V
V
V
0.1
0.1
0.1
uA
uA
uA
conditions
MIN
60
50
5
Ic= 100 uA, I
E
=0
Ic= 0. 1 mA, I
B
=0
I
E
= 100 uA, I
C
=0
V
CB
= 60
V
CE
= 50
V
EB
=
V
CE
=
5
V,
V,
I
E
=0
I
B
=0
V, I
C
=0
I
C
= 2mA
70
6 V,
700
0.25
1
V
V
MHz
3.5
10
pF
dB
I
C
= 100mA, I
B
= 10 mA
I
C
= 100 mA, I
B
= 10mA
V
CE
= 10 V, I
C
= 1mA
f=30MHz
VCB=10V,IE=0
f=1MHZ
V
CE
= 6 V, I
C
=0.1 mA
f =1KHz,RG=10K
80
CLASSIFICATION OF
Rank
Range
h
FE(1)
O
70-140
Y
120-240
GR
200-400
BL
350-700
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