AZ23C3V0 datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> AZ23C3V0

AZ23C3V0: DescriptionZener diode; CategoryDiscrete semiconductor; File Size823KB，2 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

View All

AZ23C3V0 Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	AZ23C3V0	-	-	View	Buy Now

AZ23C3V0 Overview

Zener diode

Features

Product Name: Zener Diode

Product model: AZ23C3V0

product features:

Dual zeners in common anode configuration.

300mW power dissipation rating.

Ideally suited for automatic insertion.

△vz for both diodes in one case is ≤5%.

Common cathode style available see DZ series.

Also available in lead free version.

Product parameters:

Pd power dissipation: 300mW

Vz stable voltage: Nom=3V Min=2.8V Max=3.2V

Zzt breakdown impedance: 95Ω

Zzk breakdown impedance: 500Ω

IR reverse current: 0.1uA

Vf forward voltage drop: 0.9V

Package: SOT-23

AZ23C3V0 Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

SOT-23 Plastic-Encapsulate Diode

AZ23C2V7-AZ23C39

ZENER DIODE

FEATURES：

∙

Dual zeners in common anode configuration.

∙

300mW power dissipation rating.

∙

Ideally suited for automatic insertion.

∙

△vz

for both diodes in one case is

≤5%.

∙

Common cathode style available see DZ series.

∙

Also available in lead free version.

SOT-23

Maximum Ratings(T

=25℃ unless otherwise specified)

Characteristic

Power Dissipation

Thermal Resistance, Junction to Ambient Air

Operating and Storage Temperature Range

Symbol

θJA

STG

Value

300

417

-65~+150

Unit

℃

A,Jun,2011

Recommended Resources

Surround sound AD converter circuit c

Versatile Hi-Fi preamplifier

STK085-105 power amplifier circuit diagram

Phone volume keying circuit

High power stabilized voltage inverter power supply circuit diagram

On-site signal optical fiber transmission and reception circuit

[STM32MP157C-EV1] After the first unboxing and evaluation, I will run rtt on it and share other: [b][color=#5E7384]This content is originally created by EEWORLD forum user [size=3]Fillmore[/size]. If you need to reprint or use it for commercial purposes, you must obtain the author's consent and i...; Fillmore ST Sensors & Low Power Wireless Technology Forum

If you understand these eight basic circuits, analog circuit analysis will not be difficult!: In electronic circuits, power supply, amplification, oscillation and modulation circuits are called analog electronic circuits because they process and handle continuously changing analog signals. 1. ...; 可乐zzZ MCU

MSP430 Program Library---Button: Keys are one of the most commonly used input devices in single-chip microcomputer systems; almost as long as interactive input is required, a keyboard is necessary. This blog implements a general keyb...; fish001 Microcontroller MCU

EEWORLD University ---- Live Replay: How Littelfuse Improves the Safety and Reliability of Electronic Equipment in Smart Buildings in the Internet of Things Era: Live Replay: How Littelfuse improves the safety and reliability of smart building electronic equipment in the era of the Internet of Things : https://training.eeworld.com.cn/course/5305...; hi5 DIY/Open Source Hardware

[NXP Rapid IoT Review] + Kit Modification-External Lithium Battery: The battery life of the kit has always been a shortcoming. As long as the USB cable is not used to connect to the computer, the battery will run out in about 2 hours, which greatly reduces the experie...; hujj stm32/stm8

RL78 LCD controller display principle help: Does anyone know how to display the following 4 time slices?...; wdliming Renesas Electronics MCUs

Popular Components