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Changdian Technology Debuts at 2021 World Semiconductor Conference, Advanced Packaging Leads Chip Finished Product Manufacturing June 9, 2021, Shanghai, China - On June 9, the 2021 World Semiconduc...[Details]

During TSMC's 2021 online technical seminar, Senior Vice President of Operations YP Chin disclosed important progress related to the company's chip manufacturing capabilities. It is reported that TSM...[Details]

On May 19, 2023, Renesas Electronics announced the company's 2030 vision at the 2023 Investor Day: by then, the company's total revenue will exceed 20 billion US dollars, and it hopes to become the t...[Details]

Yesterday, Arm launched the Cortex-M52 processor designed for dedicated AI applications. Although it did not trigger much discussion, its actual significance is far beyond imagination.   You know, th...[Details]

On March 23, a 6.6-magnitude earthquake occurred in the sea area of ​​Taitung County, Taiwan, China in the early hours of this morning. Since then, there have been continuous aftershocks of varying s...[Details]

A new technique can produce perovskite nanocrystals exactly where they are needed, so this extremely delicate material can be integrated into nanoscale devices. MIT researchers have developed a bre...[Details]

Beijing time, July 19th morning news, it is reported that after several Chinese Internet giants launched chip projects one after another, ByteDance also plans to design chips independently. A ByteD...[Details]

Recently, sources said that the United States is considering restricting the export of American chip manufacturing equipment to Chinese memory chip manufacturers. American experts said that the gover...[Details]

Accelerate chip design for mobile, consumer, automotive, wireless infrastructure and IoT markets MOUNTAIN VIEW, Calif., May 29, 2019 /PRNewswire/ -- CEVA, Inc., a leading global lice...[Details]

Samsung Electronics said it has opened a new R&D research laboratory in Silicon Valley, USA, to focus on the development of next-generation 3D DRAM chips. The laboratory, operated by Device Solution...[Details]

In March this year, Intel's new CEO Henry Kissinger announced the new IDM 2.0 strategy. Since then, Intel has started a large-scale factory expansion plan, and will build wafer manufacturing and pack...[Details]

According to Reuters on March 18, two people familiar with the matter revealed that TSMC is considering building advanced packaging production capacity in Japan, which would add impetus to Japan's re...[Details]

"By replacing one manual worker with a robotic arm, one assembly line has reduced five work stations, and each machine has saved 30 seconds of assembly time on average, saving up to one million in OE...[Details]

On February 22, according to Kyodo News, the Japanese government decided to provide a financial subsidy of approximately 730 billion yen (currently approximately 34.967 billion yuan) to the second fa...[Details]

A report released by market research firm Gartner on Thursday showed that global semiconductor market sales in 2021 increased 26.3% year-on-year to US$595 billion, with Samsung Electronics surpassing...[Details]