2SD789D(TO-92L) datasheet, PDF

Datasheet> All Categories > Discrete semiconductor> The transistor> 2SD789D(TO-92L)

2SD789D(TO-92L): DescriptionTransistor; CategoryDiscrete semiconductor The transistor; File Size110KB，1 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet Parametric View All

2SD789D(TO-92L) Overview

Transistor

2SD789D(TO-92L) Parametric

Parameter Name	Attribute value
package instruction	,
Reach Compliance Code	unknow
Base Number Matches	1

2SD789D(TO-92L) Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

TO-92L Plastic-Encapsulate Transistors

TO – 92L

2SD789

TRANSISTOR (NPN)

1. EMITTER

2. COLLECTOR

3. BASE

FEATURES

Low Frequency Power Amplifier

MAXIMUM RATINGS (T

=25℃ unless otherwise noted)

Symbol

CBO

CEO

EBO

θJA

stg

Parameter

Collector-Base Voltage

Collector-Emitter Voltage

Emitter-Base Voltage

Collector Current

Collector Power Dissipation

Thermal Resistance From Junction To Ambient

Junction Temperature

Storage Temperature

Value

100

750

167

150

-55~+150

Unit

℃/W

℃

ELECTRICAL CHARACTERISTICS (T

=25℃ unless otherwise specified)

Parameter

Collector-base breakdown voltage

Collector-emitter breakdown voltage

Emitter-base breakdown voltage

Collector cut-off current

Emitter cut-off current

DC current gain

Collector-emitter saturation voltage

Collector output capacitance

Transition frequency

Symbol

(BR)CBO

(BR)CEO

(BR)EBO

CBO

EBO

CE(sat)

Test

conditions

Min

100

0.2

100

800

0.3

MHz

Typ

Max

Unit

μA

= 10µA,I

=1mA,I

=10µA,I

=80V,I

=6V,I

=2V, I

=100mA

=1A,I

=100mA

=10V,I

=0, f=1MHz

=2V,I

=10mA

CLASSIFICATION OF h

RANK

RANGE

100-200

160-320

250-500

400-800

A,Dec,2010

Recommended Resources

power transmission system power

KTM03 type circuit for single-phase half-controlled rectification and speed regulation

Filter circuit diagram

Mail overweight warning circuit diagram

500w to 5V dual forward buck isolated output circuit

Angel water dispenser circuit, Samsung 57C2304, with LCD display

How to convert PWM signal into analog signal: There is a position sensor that measures position changes . I used the voltage range of a multimeter to measure the output signal of the sensor, and the result showed an analog signal, that is, the po...; Aguilera Analogue and Mixed Signal

【AT32WB415 Review】Serial Communication and MP3 Module Playback Control: The AT32WB415 series has three built-in universal synchronous/asynchronous receivers and transmitters (USART1, USART2, and USART3). And 1 universal asynchronous receiver and transmitter (UART5). USART...; jinglixixi RF/Wirelessly

Simulation design of phase-shifted resonant power supply and its synchronous rectification circuit: Guys, what are the specific tasks to be done in this topic? Thank you in advance for your enthusiastic answers....; xyp9x Power technology

A very detailed disassembly of the Joyoung soymilk maker!: Joyoung Soymilk Maker, the best soymilk maker There are inevitable reasons for a product to sell well. When we talk about soymilk machines, we naturally can't help but think of Joyoung, which has almo...; wangerxian PCB Design

How to make a self-propelled car: I want to make a self-propelled car by myself, including some functions such as obstacle avoidance and recognition, but I don't know what parts and materials I need. If anyone knows, can you share it ...; XUTWOTWO DIY/Open Source Hardware

Research on WiMAX Network Application Scheme Based on IEEE 802.16e Technology: The IEEE 802.16 working group recently released the wireless metropolitan area network standards IEEE 802.16-2004 and IEEE 802.16e, which support fixed and mobile broadband wireless access. Both IEEE ...; Jacktang Wireless Connectivity

Popular Components