2SC1008R datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Discrete semiconductor> The transistor> 2SC1008R

2SC1008R: DescriptionTransistor; CategoryDiscrete semiconductor The transistor; File Size112KB，1 Pages; ManufacturerJCET; Websitehttp://www.cj-elec.com/; Jiangsu Changdian Technology Co., Ltd. focuses on semiconductor packaging and testing business, providing customers at home and abroad with a full range of solutions such as chip testing, packaging design, packaging testing, etc. The company was successfully listed on the Shanghai Main Board in 2003, becoming the first semiconductor packaging and testing listed company in China. It now has a national enterprise technology center and a postdoctoral research workstation. It is a national key high-tech enterprise, a supporting unit of the National Engineering Laboratory for High-density Integrated Circuits, and the chairman unit of the Integrated Circuit Packaging Technology Innovation Strategic Alliance.

Discrete devices: diodes (switching diodes, Schottky diodes (Schottky rectifiers), voltage regulator diodes, Pin diodes, TVS diodes, rectifier diodes, fast recovery diodes); transistors (Darlington tubes, digital transistors, MOSFETs); thyristors: silicon-controlled rectifiers, triacs; composite tubes: transistors + field-effect tubes, dual transistors, dual digital transistors, digital transistors + transistors, transistors + diodes, field-effect tubes + diodes, dual field-effect tubes. Voltage regulator circuit; energy-saving lamp charger switch tube

Lead frame: TO series (TO); SOD series (SOD); SOT series (TSOT, SOT); FBP series (WBFBP); QFN series (QFNWB, DFNWB, DFNFC, QFNFC); QFP series (LQFP: PQFP: PLCC: TQFP); SIP series (SIP, HSIP, FSIP); SOP series (SOP, HSOP, SSOP, MSOP, HTSOP, TSSOP); DIP series (DIP, FDIP, SDIP); PDFN series; PQFN series; MIS series (MISFC, MISWB)

Nine core technologies: Through Silicon Via (TSV) packaging technology; SiP RF packaging technology; wafer-level 3D rewiring packaging process technology; copper bump interconnection technology; high-density FC-BGA packaging and testing technology (Flip Chip BGA); multi-turn array four-sided pinless packaging and testing technology; package body 3D stacking technology; 50μm or less ultra-thin chip 3D stacking packaging technology; MEMS multi-chip packaging technology; MIS packaging technology (pre-encapsulated interconnection system); BGA packaging technology, etc.

Download Datasheet Parametric View All

2SC1008R Overview

Transistor

2SC1008R Parametric

Parameter Name	Attribute value
package instruction	,
Reach Compliance Code	unknow
Maximum collector current (IC)	0.7 A
Configuration	Single
Minimum DC current gain (hFE)	40
Maximum operating temperature	150 °C
Polarity/channel type	NPN
Maximum power dissipation(Abs)	0.8 W
surface mount	NO
Nominal transition frequency (fT)	30 MHz
Base Number Matches	1

2SC1008R Preview

Download Datasheet

View All

JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD

TO-92 Plastic-Encapsulate Transistors

TO – 92

2SC1008

TRANSISTOR (NPN)

1. EMITTER

2. BASE

3. COLLECTOR

FEATURES

General Purpose Switching and Amplification

MAXIMUM RATINGS (T

=25℃ unless otherwise noted)

Symbol

CBO

CEO

EBO

θJA

stg

Parameter

Collector-Base Voltage

Collector-Emitter Voltage

Emitter-Base Voltage

Collector Current

Collector Power Dissipation

Thermal Resistance From Junction To Ambient

Junction Temperature

Storage Temperature

Value

700

800

156

150

-55~+150

Unit

℃/W

℃

ELECTRICAL CHARACTERISTICS (T

=25℃ unless otherwise specified)

Parameter

Collector-base breakdown voltage

Collector-emitter breakdown voltage

Emitter-base breakdown voltage

Collector cut-off current

Emitter cut-off current

DC current gain

Collector-emitter saturation voltage

Base-emitter saturation voltage

Collector output capacitance

Transition frequency

Symbol

(BR)CBO

(BR)CEO

(BR)EBO

CBO

EBO

CE(sat)

BE (sat)

Test

conditions

Min

0.1

400

0.4

1.1

MHz

Typ

Max

Unit

μA

= 0.1mA,I

=10mA,I

=0.01mA,I

=60V,I

=5V,I

=2V, I

=50mA

=500mA,I

=50mA

=500mA,I

=50mA

=10V,I

=0, f=1MHz

=10V,I

= 50mA

CLASSIFICATION OF h

RANK

RANGE

40-80

70-140

120-240

200-400

A,Dec,2010

Recommended Resources

Electric contact pressure gauge liquid level automatic control circuit 5

High performance antenna amplifier circuit c

Online resistance test circuit

Easy CATV Supplementary Channel Converter

Simple power outage self-locking switch circuit

555-8kv high voltage generator circuit

Please advise on the external magnetic field distribution of a C-shaped energized coil: Suppose a coil is wound on a C-shaped iron core, with the cross-sections of the two ends of the core parallel. After power is applied, does the external magnetic field concentrate in the space between...; aallian Analog electronics

How to deduce normalized parameters from transfer functions and then design filters: [i=s]This post was last edited by VincentLee90 on 2019-5-18 22:49[/i] [align=left][size=14px][font=Tahoma][size=3]Some friends asked me how to design a filter with gain before? What if the normalized ...; VincentLee90 Analog electronics

Output swings to GND Single supply, low side, unidirectional current circuit: Please help explain the title, and if possible, write a waveform explanation by hand, thank you!...; zzw_rst Analog electronics

About the problem of converting schematic diagram to PCB when designing RF PCB circuit: I am using Altium Designer to design a Ku-band PCB. The chip package size is relatively small, and the spacing between pads is also small. If I import the schematic directly into the PCB, I will find ...; 明天你好123 PCB Design

QSPI read, write and erase flash: I originally wanted to test the low power consumption, but when I saw that the board had to be cut, I decided to leave it for later and run the external flash function first. 1. Determine the hardware...; 过问_小白 GD32 MCU

【CH579M-R1】+OTA principle and source code analysis: Principle Analysis First, let's talk about the program image. A complete program image can be divided into two parts: "interrupt vector table" and "logic program" (let's name it this way for the conve...; Ansersion Special Edition for Assessment Centres

Popular Components