1SS390T/R7 datasheet, PDF - EEWORLD Datasheet

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1SS390T/R7: DescriptionPin Diode, 35V V(BR), Silicon, ROHS COMPLIANT, PLASTIC PACKAGE-2; CategoryDiscrete semiconductor diode; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

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1SS390T/R7 Overview

Pin Diode, 35V V(BR), Silicon, ROHS COMPLIANT, PLASTIC PACKAGE-2

1SS390T/R7 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
package instruction	R-PDSO-F2
Contacts	2
Reach Compliance Code	compli
ECCN code	EAR99
Minimum breakdown voltage	35 V
Configuration	SINGLE
Maximum diode capacitance	1.2 pF
Diode component materials	SILICON
Maximum diode forward resistance	0.9 Ω
Diode type	PIN DIODE
JESD-30 code	R-PDSO-F2
Number of components	1
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Maximum power dissipation	0.2 W
surface mount	YES
technology	POSITIVE-INTRINSIC-NEGATIVE
Terminal form	FLAT
Terminal location	DUAL
Maximum time at peak reflow temperature	NOT SPECIFIED
Base Number Matches	1

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1SS390

SURFACE MOUNT PIN DIODE

VOLTAGE

FEATURES

Very low series resistance at 100MHz (0.45

Ω

typical@I

=2mA)

Low capacitance (0.8pF typical@V

=6V)

Surface mount package ideally suited for automatic insertion

Lead free in comply with EU RoHS 2002/95/EC directives.

Green molding compound as per IEC61249 Std. . (Halogen Free)

0.034(0.85)

0.029(0.75)

0.050(1.25)

0.045(1.15)

0.014(0.35)

0.009(0.25)

0.026(0.65)

0.021(0.55)

35 Volts

POWER

200 mW

SOD-523

Unit

：

inch(mm)

MECHANICAL DATA

Case: SOD-523 plastic

Terminals : Solderable per MIL-STD-750,Method 2026

Approx Weight: 0.0001 ounces, 0.0014 grams

Device Marking : 90

0.006(0.15)

0.002(0.05)

0.067(1.70)

0.059(1.50)

0.20 MIN.

ABSOLUTE RA

TINGS

Parameter

Maximum Reverse Voltage

Continuous Forward Current

Symbol

Value

0.2

Units

THERMAL CHARACTERISTICS

Parameter

Power Dissipation (Note 1)

Thermal Resistance, Junction to Ambient (Note 1)

Junction Temperaure

Storage Temperature

Symbol

Value

200

625

-55 to 150

Units

C/W

T O T

S T G

Note 1 : FR-4 Board 70 x 60 x 1mm.

REV.0.0-FEB.12.2009

PAGE . 1

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