1SMB2EZ16_R1_00001 datasheet, PDF

Datasheet> All Categories > Discrete semiconductor> diode> 1SMB2EZ16_R1_00001

1SMB2EZ16_R1_00001: DescriptionZener Diode,; CategoryDiscrete semiconductor diode; ManufacturerPANJIT; Websitehttp://www.panjit.com.tw/; Environmental Compliance; PANJIT is a global IDM that offers a broad product portfolio including MOSFETs, Schottky diodes, SiC devices, bipolar junction transistors and bridges. The company aims to meet the needs of customers in various applications such as automotive, power, industrial, computing, consumer and communications. Their vision is to power the world with reliable quality, energy-efficient and efficient products, bringing a greener and smarter future to people. The company's core values include innovation, responsibility, customer-centricity, learning and growth, mutual trust and collaboration.

Parametric View All

1SMB2EZ16_R1_00001 Online Shopping

Suppliers	Part Number	Price	MOQ	In stock
	1SMB2EZ16_R1_00001	-	-	View	Buy Now

1SMB2EZ16_R1_00001 Overview

Zener Diode,

1SMB2EZ16_R1_00001 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
package instruction	R-PDSO-C2
Reach Compliance Code	not_compliant
ECCN code	EAR99
Is Samacsys	N
Configuration	SINGLE
Diode component materials	SILICON
Diode type	ZENER DIODE
Maximum dynamic impedance	8 Ω
JEDEC-95 code	DO-214AA
JESD-30 code	R-PDSO-C2
Maximum knee impedance	700 Ω
Number of components	1
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-55 °C
Package body material	PLASTIC/EPOXY
Package shape	RECTANGULAR
Package form	SMALL OUTLINE
polarity	UNIDIRECTIONAL
Maximum power dissipation	2 W
Nominal reference voltage	16 V
Maximum reverse current	0.5 µA
Reverse test voltage	12.2 V
surface mount	YES
technology	ZENER
Terminal form	C BEND
Terminal location	DUAL
Maximum voltage tolerance	5%
Working test current	31.2 mA
Base Number Matches	1

1SMB2EZ16_R1_00001 Preview

Download Datasheet

View All

1SMB2EZ6.8~1SMB2EZ51

GLASS PASSIVATED JUNCTION SILICON ZENER DIODES

VOLTAGE

FEATURES

• Glass passivated iunction

• Low inductance

• Typical I

less than 1.0µA above 11V

• Plastic package has Underwriters Laboratory Flammability

Classification 94V-O

• High temperature soldering : 260°C /10 seconds at terminals

• Lead free in compliance with EU RoHS 2011/65/EU directive

• Green molding compound as per IEC61249 Std. . (Halogen Free)

6.8 to 51 Volt

POWER

2 Watt

MECHANICAL DATA

• Case: JEDEC DO-214AA, Molded plastic over passivated junction

• Terminals: Solder plated, solderable per MIL-STD-750, Method 2026

• Polarity: Color band denotes cathode end

• Standard packing: 12mm tape (E1A-481)

• Weight: 0.0032 ounce, 0.092 gram

MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS

Ratings at 25°C ambient temperature unless otherwise specified.

Parameter

Peak Pulse Power Dissipation on T

=50

C (Notes A)

Derate above 50

Peak Forward Surge Current 8.3ms single half sine-wave

superimposed on rated load

Operating Junction and Storage Temperature Range

Symbol

Value

Units

W atts

FSM

STG

-55 to + 150

Amps

NOTES :

A.Mounted on 5mm

(0.013mm thick) land areas.

B.Measured on 8.3ms, and single half sine-wave or equivalent square wave, duty cycle=4 pulses per minute maximum

November 9,2015-REV.06

PAGE . 1

Recommended Resources

50-150MHz overtone oscillator circuit diagram

Flash doorbell circuit

Battery dual-state charging circuit

Capacitance measurement circuit

845E computer motherboard circuit diagram_23

Computer motherboard circuit diagram 810 2_25

[Synopsys IP Resources] Prototyping as a Service (PaaS): Breaking through chip design process bottlenecks and simplifying the path to innovation: The success of tape-out is undoubtedly the common goal of all chip developers, otherwise the time-consuming and long-lasting efforts and the high costs of tape-out will be wasted. FPGA-based prototype...; arui1999 Integrated technical exchanges

How to write the test bench file for the verliog10 divider: ...; Gerryi EE_FPGA Learning Park

[Xianji HPM6750 Review] + Environment Setup Test: In the previous article, we introduced the relevant performance after unpacking. In this article, we use two routines to complete the initial development test.First, we unzip the SDK. There are some c...; 流行科技 Domestic Chip Exchange

EEWORLD University ---- Webinar: Thermal Monitoring and Protection: Webinar: Thermal Monitoring and Protection : https://training.eeworld.com.cn/course/5285Thermal monitoring is a classic techniques used to enhance system efficiency while ensuring system safety and he...; hi5 Talking

How to solve the power supply ripple: I designed a project, which is similar to the previous project. There are LDO33 and LDO120 inside, but the ripple of 3.3 and 1.2 measured by myself is very large. The filter circuits are the same and ...; lx331lx Analog electronics

【AT-START-F425 Review】No.06 Driving Segment LCD: ## Preface: I made an SLCD screen when I was tinkering with GD32L233. I modified it and it ran on AT32F425. The board is actually quite simple. The board is as follows: ![SLCD board](https://s2.loli.n...; 韵湖葱白 Domestic Chip Exchange

Popular Components