MC33077P datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Analog mixed-signal IC> Amplifier circuit> MC33077P

MC33077P: Part NumberMC33077P; CategoryAnalog mixed-signal IC Amplifier circuit; File Size9798.25，13 Pages; ManufacturerRochester Electronics; Websitehttps://www.rocelec.com/

Alternative parts

Part Number	Manufacturer	Description
Sorry, there is no alternative parts yet

MC33077P Overview

MC33077P amplifier basic information:

MC33077P is an OPERATIONAL AMPLIFIER. Commonly used packaging methods are PLASTIC, DIP-8

MC33077P amplifier core information:

The MC33077P has a minimum operating temperature of -40 °C and a maximum operating temperature of 85 °C. Its peak reflow temperature is NOT SPECIFIED Its maximum average bias current is 1.2 µA

How to simply check the efficiency of an amplifier? Looking at its slew rate, the MC33077P has a nominal slew rate of 11 V/us. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the MC33077P gain becomes 0.707 times the low-frequency gain is 7500 kHz.

The nominal supply voltage of the MC33077P is 15 V, and its corresponding nominal negative supply voltage is -15 V. The input offset voltage of MC33077P is 1500 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)

Related dimensions of MC33077P:

The width of MC33077P is: 7.62 mm and the length is 9.78 mm. MC33077P has 8 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm. Total pins: 8

MC33077P amplifier additional information:

Its temperature grade is: INDUSTRIAL. And its humidity sensitivity level is: NOT SPECIFIED. It contains lead. The corresponding JESD-30 code is: R-PDIP-T8. The corresponding JESD-609 code is: e0.

The packaging code of MC33077P is: DIP. MC33077P packaging materials are mostly PLASTIC/EPOXY. The package shape is RECTANGULAR. The MC33077P package pin format is: IN-LINE. Its terminal form is: THROUGH-HOLE.

The maximum seat height is 4.45 mm.

Recommended Resources

High-power switching power supply composed of L4970A

Low power non-inverting amplifier circuit diagram with digital input and gain selection

Simple stepless speed fan circuit

Headphone amplifier circuit using dual operational amplifiers such as OPA2604

555 simple and practical music light control circuit

810E computer motherboard circuit diagram_18

Beetle ESP32-C3 test (Part 1) Unboxing and filling holes: As soon as the development board arrived, I powered it up and tried it out. I thought it would be the same as the Espressif products I used in the past. I just connected it to the UART port and sent AT commands. But it wasn't....... It's like ...; bigbat RF/Wirelessly

[RVB2601 Creative Application Development] 5. OLED Displays Weather Information: 1. Overview In the previous article, we have realized the acquisition of weather data and then printed it out through the serial port. 4. Get weather information with cJSON This article mainly realizes the display of data on OLED. 2....; xinmeng_wit XuanTie RISC-V Activity Zone

Realization of various wavelet transforms based on FPGA: Based on the lifting framework wavelet transform method, various wavelet transforms can be realized by utilizing the programmable characteristics of FPGA. The lifting framework (LS) is a wavelet transform method proposed by Sweldens et al. in rece...; fish001 Microcontroller MCU

Ended -- Microchip Live Broadcast [Implementing MultiZone Security in RISC-V Applications]: During this special period, we are on hold to learn, watch the technical live broadcast together, and get new energy from Microchip! When the dark clouds disperse and spring comes, make yourself stronger! This is the first of 12 webinars in Microc...; EEWORLD社区 Security Electronics

The Secret and Application of Vertical Spectral Confocal on Glass: In modern industry and scientific research, glass is widely used in various fields due to its transparency, hardness and easy processing. However, measuring the thickness of glass has always been a major problem that has troubled the industry. Altho...; 立仪科技 MEMS sensors

MC33077P Also View