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TLE2161MFKB

Part NumberTLE2161MFKB
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size4852.41,29 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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TLE2161MFKB Overview

Basic information of TLE2161MFKB amplifier:

TLE2161MFKB is an OPERATIONAL AMPLIFIER from Texas Instruments. Commonly used packaging methods are CERAMIC, LCC-20

TLE2161MFKB amplifier core information:

The minimum operating temperature of TLE2161MFKB is -55 °C and the maximum operating temperature is 125 °C. Its peak reflow temperature is NOT SPECIFIED Its maximum average bias current is 0.04 µA

How to simply check the efficiency of an amplifier? Looking at its slew rate, the nominal slew rate of TLE2161MFKB is 10 V/us. The maximum slew rate of the TLE2161MFKB given by the manufacturer is 0.375 mA, while the minimum slew rate is 5 V/us. Its minimum voltage gain is 500. When the op amp is used in a closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the TLE2161MFKB gain becomes 0.707 times the low-frequency gain is 5600 kHz.

The nominal supply voltage of TLE2161MFKB is 5 V, and its corresponding nominal negative supply voltage is -5 V. The input offset voltage of TLE2161MFKB is 6000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)

Related dimensions of TLE2161MFKB:

The width of TLE2161MFKB is: 8.89 mm and the length is 8.89 mm. TLE2161MFKB has 8 terminals. Its terminal position type is: QUAD. Terminal pitch is 1.27 mm. Total pins: 20

TLE2161MFKB amplifier additional information:

TLE2161MFKB adopts the VOLTAGE-FEEDBACK architecture. It belongs to the low-bias class of amplifiers. It does not belong to the low offset class of amplifiers. The frequency compensation status of TLE2161MFKB is: YES (AVCL>=5). Its temperature grade is: MILITARY.

It is a micropower amplifier. TLE2161MFKB is not Rohs certified. It contains lead. The corresponding JESD-30 code is: S-CQCC-N8. The packaging code of TLE2161MFKB is: QCCN.

The materials of TLE2161MFKB package are mostly CERAMIC, METAL-SEALED COFIRED. The package shape is SQUARE. TLE2161MFKB package pin form is: CHIP CARRIER. Its terminal forms are: NO LEAD. The maximum seat height is 2.03 mm.

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