| Part Number | Manufacturer | Description |
|---|---|---|
| LMH6722MA/NOPB | Texas Instruments | Gain-bandwidth product (GBP): - Number of amplifier groups: 4 Op amp type: High-speed wideband op amp Input offset voltage (Vos): 200uV Input bias current (Ib): 1uA Unity gain bandwidth (-3db): 400MHz Slew rate (SR): 1800 V/us Power supply voltage: 8V ~ 12.5V Quad wideband video operational amplifier |
| LMH6722MT/NOPB | Texas Instruments | Quad Wideband Video Op Amp 14-TSSOP -40 to 85 |
| LMH6722MAX/NOPB | Texas Instruments | Quad Wideband Video Op Amp 14-SOIC -40 to 85 |
| LMH6722MTX/NOPB | Texas Instruments | Quad Wideband Video Op Amp 14-TSSOP -40 to 85 |
| LMH6722QSDX | Texas Instruments | 1 CHANNEL, VIDEO AMPLIFIER, PDSO14, SOIC-14 |
| LMH6722MA | National Semiconductor Corporation | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| LMH6722MT | National Semiconductor Corporation | IC 1 CHANNEL, VIDEO AMPLIFIER, PDSO14, SOIC-14, Audio/Video Amplifier |
| LMH6722MAX | National Semiconductor Corporation | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| LMH6722SD | Texas Instruments | 1 CHANNEL, VIDEO AMPLIFIER, PDSO14, SOIC-14 |
| LMH6722QSD | Texas Instruments | 1 CHANNEL, VIDEO AMPLIFIER, PDSO14, SOIC-14 |
| LMH6722MTX | National Semiconductor Corporation | IC 1 CHANNEL, VIDEO AMPLIFIER, PDSO14, SOIC-14, Audio/Video Amplifier |
| CLC415MDC | National Semiconductor Corporation | IC VIDEO AMPLIFIER, UUC14, DIE, Audio/Video Amplifier |
| LMH6722SDX | Texas Instruments | 1 CHANNEL, VIDEO AMPLIFIER, PDSO14, SOIC-14 |
Basic information of HFA1405IA96 amplifier:
HFA1405IA96 is an OPERATIONAL AMPLIFIER. The commonly used packaging method is SSOP,
HFA1405IA96 amplifier core information:
Related dimensions of HFA1405IA96:
The width of HFA1405IA96 is: 3.9 mm and the length is 4.89 mm. HFA1405IA96 has 16 terminals. Its terminal position type is: DUAL. Terminal pitch is 0.635 mm. Total pins: 16
HFA1405IA96 amplifier additional information:
Its temperature grade is: INDUSTRIAL. The corresponding JESD-30 code is: R-PDSO-G16. The packaging code of HFA1405IA96 is: SSOP. HFA1405IA96 packaging materials are mostly PLASTIC/EPOXY. The package shape is RECTANGULAR.
HFA1405IA96 package pin forms are: SMALL OUTLINE, SHRINK PITCH. Its terminal forms are: GULL WING. The maximum seat height is 1.73 mm.
HFA1405IA96 Also View
You may also be interested in
Popular Searches
EEWorld
subscription
account
EEWorld
service
account
Automotive
development
circle
About Us Customer Service Contact Information Datasheet Sitemap LatestNews
Site Related: China chips Training TI Training Datasheet EEWORLD
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
京公网安备 11010802033920号
EEWORLD
