Part Number | Manufacturer | Description |
---|---|---|
TLV2774AQDRQ1 | Texas Instruments | QUAD OP-AMP, 5.1MHz BAND WIDTH, PDSO14, SOIC-14 |
LMV324DR2G | ON Semiconductor | Gain bandwidth product (GBP): 1MHz Number of amplifier groups: 4 Op amp type: General Purpose Power consumption of each channel: 410uA Slew rate (SR): 1 V/us Power supply voltage: 2.7V ~ 5.5V |
TLV2774QDRQ1 amplifier basic information:
TLV2774QDRQ1 is an OPERATIONAL AMPLIFIER. The commonly used packaging method is SOIC-14
TLV2774QDRQ1 amplifier core information:
The minimum operating temperature of the TLV2774QDRQ1 is -40 °C and the maximum operating temperature is 125 °C. Maximum bias current at 25°C: 0.00006 µA
How to simply check the efficiency of an amplifier? Looking at its slew rate, the nominal slew rate of TLV2774QDRQ1 is 10.5 V/us. The maximum slew rate of the TLV2774QDRQ1 given by the manufacturer is 2 mA, while the minimum slew rate is 4.7 V/us. Its minimum voltage gain is 13000. When the op amp is used in a closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the TLV2774QDRQ1 gain becomes 0.707 times the low-frequency gain is 5100 kHz.
The nominal supply voltage of the TLV2774QDRQ1 is 2.7 V. The power supply range is: 2.7/5 V. The input offset voltage of TLV2774QDRQ1 is 2700 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the op amp 0V (or close to 0V).)
Related dimensions of TLV2774QDRQ1:
The width of TLV2774QDRQ1 is: 3.9 mm and the length is 8.65 mm. TLV2774QDRQ1 has 14 terminals. Its terminal position type is: DUAL. Terminal pitch is 1.27 mm. Total pins: 14
TLV2774QDRQ1 amplifier additional information:
TLV2774QDRQ1 adopts the VOLTAGE-FEEDBACK architecture. It belongs to the low-bias class of amplifiers. It does not belong to the low offset class of amplifiers. The frequency compensation status of TLV2774QDRQ1 is: YES. Its temperature grade is: AUTOMOTIVE.
The corresponding JESD-30 code is: R-PDSO-G14. The packaging code of TLV2774QDRQ1 is: SOP. The materials of TLV2774QDRQ1 package are mostly PLASTIC/EPOXY. The package shape is RECTANGULAR. The TLV2774QDRQ1 package pin format is: SMALL OUTLINE.
Its terminal forms are: GULL WING. The maximum seat height is 1.75 mm.
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