LMV1012UP-25 datasheet, PDF - EEWORLD Datasheet

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LMV1012UP-25: Part NumberLMV1012UP-25; CategoryConsumption circuit; File Size11436.11，23 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

Alternative parts

Part Number	Manufacturer	Description
LMV1012UP-25/NOPB	Texas Instruments	Analog Pre-Amplified IC for High Gain Microphones 4-DSBGA
LMV1012UPX-25	National Semiconductor Corporation	1 CHANNEL, AUDIO PREAMPLIFIER, PBGA4
LMV1012UPX-25/NOPB	Texas Instruments	Microphone Preamplifiers Analog Pre-Amplified IC for High Gain Microphones 4-DSBGA -40 to 85
LMV1012UP-25	National Semiconductor Corporation	1 CHANNEL, AUDIO PREAMPLIFIER, PBGA4

LMV1012UP-25 Overview

LMV1012UP-25 amplifier basic information:

Commonly used packaging methods are 0.40 MM HEIGHT, LEAD FREE, MO-211CA, MICRO, SMD-4

LMV1012UP-25 amplifier core information:

The LMV1012UP-25 has a minimum operating temperature of -40 °C and a maximum operating temperature of 85 °C. Its peak reflow temperature is 260

The amplifier gain of LMV1012UP-25 can reach: 23.8 dB (Amplifier gain is the logarithm of the ratio of amplifier output power to input power, used to indicate the degree of power amplification. It also refers to the amplification factor of voltage or current. Similarly, decibels is the amplifier gain unit.)

Related dimensions of LMV1012UP-25:

The width of LMV1012UP-25 is: 0.93 mm and the length is 1.006 mm. LMV1012UP-25 has 4 terminals. Its terminal position type is: BOTTOM. Terminal pitch is 0.5 mm. Total pins: 4

LMV1012UP-25 amplifier additional information:

Its temperature grade is: INDUSTRIAL. And its humidity sensitivity level is: 1. The LMV1012UP-25 is not Rohs certified. It contains lead. The corresponding JESD-30 code is: R-PBGA-B4.

The package code of LMV1012UP-25 is: VFBGA. LMV1012UP-25 packaging materials are mostly PLASTIC/EPOXY. The package shape is RECTANGULAR. LMV1012UP-25 package pin forms are: GRID ARRAY, VERY THIN PROFILE, FINE PITCH. Its terminal forms are: BALL.

The maximum seat height is 0.4 mm.

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