Part Number | Manufacturer | Description |
---|---|---|
HFA1115IP | Rochester Electronics LLC | Basic information of HFA1115IP amplifier:HFA1115IP is a BUFFER. Commonly used packaging methods are,... |
HFA1113MJ/883 | Rochester Electronics LLC | Basic information of HFA1113MJ/883 amplifier:HFA1113MJ/883 is a BUFFER. Commonly used packaging meth... |
HFA1113IP | Rochester Electronics LLC | Basic information of HFA1113IP amplifier:HFA1113IP is a BUFFER. Commonly used packaging methods are,... |
5962F9678501VPA | Harris Semiconductor | 5962F9678501VPA amplifier basic information:5962F9678501VPA is a BUFFER. Commonly used packaging met... |
HFA1113IJ | Harris Semiconductor | HFA1113IJ amplifier basic information:HFA1113IJ is a BUFFER. Commonly used packaging methods are DIP... |
5962-9468201MPX amplifier basic information:
5962-9468201MPX is a BUFFER. The commonly used packaging method is DIP,
5962-9468201MPX amplifier core information:
The minimum operating temperature of 5962-9468201MPX is -55 °C and the maximum operating temperature is 125 °C.
When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the 5962-9468201MPX gain becomes 0.707 times the low-frequency gain is 500 MHz.
The nominal supply voltage of 5962-9468201MPX is 5 V, and its corresponding nominal negative supply voltage is -5 V.
Related dimensions of 5962-9468201MPX:
5962-9468201MPX has 8 terminals. Its terminal position type is: DUAL.
5962-9468201MPX amplifier additional information:
Its temperature grade is: MILITARY. The corresponding JESD-30 code is: R-CDIP-T8. The packaging code of 5962-9468201MPX is: DIP. The materials used in the 5962-9468201MPX package are mostly CERAMIC, METAL-SEALED COFIRED. The package shape is RECTANGULAR.
The 5962-9468201MPX package pin format is: IN-LINE. Its terminal form is: THROUGH-HOLE.
5962-9468201MPX Also View
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