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TL33071P

Part NumberTL33071P
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size825.61,6 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
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TL33071P Overview

Basic information of TL33071P amplifier:

TL33071P is an OPERATIONAL AMPLIFIER from Texas Instruments. Commonly used packaging methods are DIP, DIP8,.3

TL33071P amplifier core information:

The minimum operating temperature of TL33071P is -40 °C and the maximum operating temperature is 105 °C. Its peak reflow temperature is NOT SPECIFIED Its maximum bias current at 25°C is: 1.5 µA Its maximum average bias current is 1.8 µA

How to simply check the efficiency of an amplifier? Looking at its slew rate, the nominal slew rate of TL33071P is 10 V/us. The maximum slew rate of the TL33071P given by the manufacturer is 4.7 mA, while the minimum slew rate is 8 V/us. Its minimum voltage gain is 25000. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the TL33071P gain becomes 0.707 times the low-frequency gain is 4500 kHz.

The nominal supply voltage of TL33071P is 15 V, and its corresponding nominal negative supply voltage is -15 V. The input offset voltage of TL33071P is 7000 µV (input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)

Related dimensions of TL33071P:

The width of TL33071P is: 7.62 mm and the length is 9.81 mm. TL33071P has 8 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm. Total pins: 8

TL33071P amplifier additional information:

TL33071P adopts the VOLTAGE-FEEDBACK architecture. It does not belong to the low offset class of amplifiers. The frequency compensation status of TL33071P is: YES. Its temperature grade is: INDUSTRIAL. TL33071P is not Rohs certified.

It contains lead. The corresponding JESD-30 code is: R-PDIP-T8. The corresponding JESD-609 code is: e4. The packaging code of TL33071P is: DIP. The materials of TL33071P packaging are mostly PLASTIC/EPOXY.

The package shape is RECTANGULAR. The TL33071P package pin format is: IN-LINE. Its terminal form is: THROUGH-HOLE. The maximum seat height is 5.08 mm.

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