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5962-9751001QPA

Part Number5962-9751001QPA
CategoryAnalog mixed-signal IC    Amplifier circuit   
File Size9043.14,42 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
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5962-9751001QPA Overview

5962-9751001QPA amplifier basic information:

5962-9751001QPA is an OPERATIONAL AMPLIFIER from Texas Instruments. Commonly used packaging methods are CERAMIC, DIP-8

5962-9751001QPA amplifier core information:

The minimum operating temperature of the 5962-9751001QPA is -55 °C and the maximum operating temperature is 125 °C. Its peak reflow temperature is NOT SPECIFIED Its maximum average bias current is 0.0003 µA

How to simply check the efficiency of an amplifier? Looking at its slew rate, the 5962-9751001QPA has a nominal slew rate of 0.25 V/us. The manufacturer's maximum slew rate for the 5962-9751001QPA is 0.27 mA, while the minimum slew rate is 0.1 V/us. Its minimum voltage gain is 500. When the op amp is used in closed loop, at a certain closed-loop gain (usually 1 or 2, 10, etc.), the frequency when the 5962-9751001QPA gain becomes 0.707 times the low-frequency gain is 500 kHz.

The nominal supply voltage of 5962-9751001QPA is 3 V, and its corresponding nominal negative supply voltage is. The input offset voltage of the 5962-9751001QPA is 2500 µV (Input offset voltage: the compensation voltage added between the two input terminals to make the output terminal of the operational amplifier 0V (or close to 0V).)

Related dimensions of 5962-9751001QPA:

The width of 5962-9751001QPA is: 7.62 mm and the length is 9.58 mm. 5962-9751001QPA has 8 terminals. Its terminal position type is: DUAL. Terminal pitch is 2.54 mm. Total pins: 8

5962-9751001QPA amplifier additional information:

5962-9751001QPA adopts the VOLTAGE-FEEDBACK architecture. It belongs to the low-bias class of amplifiers. It does not belong to the low offset class of amplifiers. The frequency compensation status of 5962-9751001QPA is: YES. Its temperature grade is: MILITARY.

It is a micropower amplifier. 5962-9751001QPA is not Rohs certified. It contains lead. The corresponding JESD-30 code is: R-GDIP-T8. The packaging code of 5962-9751001QPA is: DIP.

The materials used in the 5962-9751001QPA package are mostly CERAMIC and GLASS-SEALED. The package shape is RECTANGULAR. The 5962-9751001QPA package pin format is: IN-LINE. Its terminal form is: THROUGH-HOLE. The maximum seat height is 5.08 mm.

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