Operational amplifiers TLC2262 and TLC2264

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Operational amplifiers TLC2262 and TLC2264 [Copy link]

Operational amplifiers TLC2262 and TLC2264
TLC2262 and TLC2264 are TI's dual and quad operational amplifiers, respectively. Both devices can be powered by single or dual power supplies, thereby enhancing the dynamic range and achieving rail-to-rail output performance. The TLC226X series is compatible with the micro-power consumption of the TLC225X and the AC performance of the TLC227X. It consumes lower power supply current when powered by batteries, while still having sufficiently good AC performance. The noise performance has been significantly improved over previously produced CMOS amplifiers. The power supply current of each amplifier is only 200μA (typical). The TLC226x series amplifiers have high input impedance and very low noise, and are suitable for small signal conditioning of high impedance sources, such as piezoelectric transducers. Due to its micro-power consumption, the device is very suitable for handheld monitoring and long-distance sensing equipment. In addition, the addition of the rail-to-rail output function has given this series a great opportunity in the interface of analog/digital conversion. In high-precision applications, the TLC226xA series can be selected, which has a maximum input bias of 950μV. The operating voltage of this series of devices is 5V or ±5V. The TLC2262/4 is a design upgrade of the TLC27M2/L4 or TS27M2/L4 standards, which enhances the dynamic range of the output, reduces the noise voltage, and reduces the input bias voltage. These enhanced features make it applicable to a wider range. When a larger output drive and a wider input voltage range are required, the TLV2432 and TLV2442 devices can be selected. When the design requires a single amplifier, the TLV2211/21/31 series can be selected. This series of devices is a single-channel rail-to-rail operational amplifier packaged in SOT-23. The small size and low power consumption make it very suitable for battery-powered devices with high-density designs.