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EAS avalanche testing can eliminate product failures caused by wafer defects and damage caused by the packaging process. It is a conventional testing method and can improve product reliability. Wafer defects and packaging damage can be controlled through some measures during the manufacturing process, thereby reducing the possibility of product failure.
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Published on 2020-12-8 21:06
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Published on 2020-12-8 19:15
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Personal signature上传了一些书籍资料,也许有你想要的:https://download.eeworld.com.cn/user/chunyang
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Published on 2020-12-8 21:02
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