Forum»Forum › ST MEMS Sensor Creative Design Competition › 2020-6-23-Took some time to draw a 3D printed shell ...

2004 views|5 replies

85 Posts	2 Resources

The OP

Published on 2020-6-23 21:00 Only look at the author

2020-6-23-Took some time to draw a 3D printed shell for the work [Copy link]

3D打印

This post is from ST MEMS Sensor Creative Design Competition

Latest reply

nmg

Come on, it’s the last week~ Details Published on 2020-6-29 07:36

okhxyyo

1w Posts	204 Resources

Published on 2020-6-24 05:48 Only look at the author

Haha, this shell is nice.

This post is from ST MEMS Sensor Creative Design Competition


Add and join groups	EEWorld service account	EEWorld subscription account	Automotive development circle

Personal signature

玩板看这里：

http://en.eeworld.com/bbs/elecplay.html

EEWorld测评频道众多好板等你来玩，还可以来频道许愿树许愿说说你想要玩的板子，我们都在努力为大家实现！

qwqwqw2088

2w Posts	341 Resources

Published on 2020-6-24 07:33 Only look at the author

In SW software, this step is called shell extraction

What software do you use?

This post is from ST MEMS Sensor Creative Design Competition

Comments

7905

The number of posts by the moderator of DesignSpark Mechanical is in the tens of thousands! It is hard for people with double-digit post counts to imagine. Details Published on 2020-6-24 08:22

7905

85 Posts	2 Resources

The OP| Published on 2020-6-24 08:22 Only look at the author

qwqwqw2088 posted on 2020-6-24 07:33 In sw software, this step is called shell extraction. What software do you use?

The number of posts by the moderator of DesignSpark Mechanical is in the tens of thousands! It is hard for people with double-digit post counts to imagine.

This post is from ST MEMS Sensor Creative Design Competition

shihuntaotie

1461 Posts	1 Resources

Published on 2020-6-24 13:35 来自手机 Only look at the author

Export the 3D image of the board and assemble it to see what it is.

This post is from ST MEMS Sensor Creative Design Competition

nmg

5213 Posts	239 Resources

Published on 2020-6-29 07:36 Only look at the author

Come on, it’s the last week~

This post is from ST MEMS Sensor Creative Design Competition


Add and join groups	EEWorld service account	EEWorld subscription account	Automotive development circle

Return list

Guess Your Favourite

Just looking around

I want to print a shell for LicheePi 4A myself. Will it be bad to spread the heat?
Amongthefirstbatchoffinalists,anetizennamedLicheePi4AhasalreadygotitOfficialsuggestion:ifyouwanttoprinttheshellyourself,youcanrefertothe3Dprintedshellsharedbythisuserhttps://wwwcom/model/482880-lichee-pi-4a-caseSuddenlyIthought:Willthe3Dpri ...
I want to draw the shells of some small products myself and then 3D print them. Which software is easier to use?
Ioftenmakesomesmallcircuitboardproducts,andIuseplasticshellstodrillholesmyselfWhatsoftwarecanhelpmegetstartedquickly?
OPEN SCOFIELD WINTER WARDROBE
[img]https://wwwnet/images/2024/11/14/1f9dff95d3bc981f8img][img]https://wwwnet/images/2024/11/14/2a81ca07f0c52991bimg]
Newbie Report Newbie Report
How to use CAN communication to control the inverter?
New version of WEBENCH user guide
[FS-IR02 + D1CS-D54] - 5: Linking with MCU (D1CS-D54)
Qorvo Acquires UWB Software Provider 7Hugs Labs SAS
Please tell me how to draw the differential line of this USB
How is the burning of OTP chip carried out after SMD?

Find a datasheet?

EEWorld Datasheet Technical Support

Hot tag

Related articles more>>

Qualcomm launches its first RISC-V architecture programmable connectivity module QCC74xM, supporting Wi-Fi 6 and other protocols
On November 14, Qualcomm announced the launch of two connectivity modules, QCC74xM and QCC730M, f
It is reported that memory manufacturers are considering using flux-free bonding for HBM4 to further reduce the gap between layers
On November 14, according to Korean media ETNews, Samsung Electronics, SK Hynix, and Micron are a
ON Semiconductor CEO Appears at Munich Electronica Show and Launches Treo Platform
During Electronica, ON Semiconductor CEO Hassane El-Khoury was interviewed by Power Electronics N
AMD launches second-generation Versal Premium series: FPGA industry's first to support CXL 3.1 and PCIe Gen 6
SEMI: Global silicon wafer shipment area increased by 6.8% year-on-year and 5.9% month-on-month in 2024Q3
TSMC's 5nm and 3nm supply reaches "100% utilization" showing its dominance in the market
LG Display successfully develops world's first stretchable display that can be expanded by 50%
Seizing the Opportunities in the Chinese Application Market: NI's Challenges and Answers
New diaphragm-free solid-state lithium battery technology is launched: the distance between the positive and negative electrodes is less than 0.000001 meters
Photoresist giant JSR Korea EUV MOR photoresist production base started construction, expected to be put into production in 2026

New Posts

Featured

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

About Us Customer Service Contact Information Datasheet Sitemap LatestNews

User Search：

Room 1530, Zhongguancun MOOC Times Building, Block B, 18 Zhongguancun Street, Haidian District, Beijing 100190, China Tel:(010)82350740 Postcode：100190

京公网安备 11010802033920号

快速回复返回顶部 Return list