|
To truly realize the 5G vision, more innovation is needed. Network base stations and user devices (such as mobile phones) are becoming thinner and smaller, and their energy consumption is becoming lower. In order to fit into small-sized devices, the printed circuit boards (PCBs) used in many RF applications are also shrinking in size. Therefore, RF application suppliers must develop new packaging technologies to minimize the footprint of RF components. Going further, some suppliers have begun to develop system-in-package (SiP) solutions to reduce the number of RF components - although this approach will increase packaging costs.
The system-in-package approach is being used for the RF front end, which includes all components between the base station and the antenna.
A typical RF front end consists of switches, filters, amplifiers, and tuning components. The size of these technical devices continues to decrease, and their integration with each other continues to increase. As a result, in 5G applications such as mobile phones, small cells, antenna array systems, and Wi-Fi, the RF front end is becoming a complex, highly integrated system package.
In any case, the realization of the 5G vision requires disruptive innovation in RF technology and packaging technology.
After reading the above description, do you think that both RF technology and packaging technology must keep pace with the times?
RF technology, packaging and design
The RF front end is composed of multiple semiconductor technology devices. The numerous 5G applications require a wide range of processing technologies, design techniques, integration methods and packaging methods to meet the needs of each unique use case.
For 5G's sub-7GHz frequency bands, the corresponding RF front-end solutions require innovative packaging methods, such as increasing the compactness of component arrangements; shortening the wire length between components to minimize losses; adopting double-sided mounting; zone shielding; and using higher-quality surface mount technology components.
All 5G use cases require RF front-end technology. The choice of RF semiconductor technology varies depending on the performance requirements such as RF function, frequency band, power level, etc. As shown in Figure 4-9, each RF function and application corresponds to multiple semiconductor technologies. These applications require a wide range of processing technologies, design techniques, integration methods, and packaging methods to meet the specific needs of each unique use case.
Figure 4-9: 5G RF communication technology.
If you want to know more detailed technical knowledge, you can click on " Popular Science | Exploring RF Front-end Technology " to learn about it. I won’t share it with you here.
| 
提升卡
变色卡
千斤顶