The MEMS Module is used to simulate the steady-state and dynamic performance of devices and can couple active and passive circuit-based devices to handle a wide range of physical phenomena found in MEMS sensors and actuators. The module\'s physics interfaces can be used to simulate structural mechanics, electrostatics, currents, piezoelectrics, piezoresistance, thin-film fluid flow, heat transfer, and circuits. These physics interfaces can also be coupled together arbitrarily to solve multiphysics problems, and a range of pre-set couplings are also available for the MEMS physics interfaces, including electromechanics (coupling electrostatic forces and structural mechanics), Joule heating, Joule heating and thermal expansion, and fluid-structure interaction.
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