About the diameter and spacing of heat dissipation holes

yjguohua

About the diameter and spacing of heat dissipation holes [Copy link]

As shown in the figure, the RU40191S and the copper sheet placed on the back are shown (two-dimensional and three-dimensional front and back views). When drilling holes on the RU40191S heat sink, what should be the appropriate size of the hole diameter and hole spacing to achieve the best heat dissipation effect?

qwqwqw2088

There is no need to place holes at the chip welding position, the solder is buried

Aperture between 0.3mm--0.6mm

Control the hole spacing yourself, and pay attention to the strength of the PCB so as not to make the board into a sieve

qwqwqw2088

The diameter of the hole should be determined according to the board and the heat dissipation conditions, and the space on Friday of the main heat dissipation chip.

The heat dissipation holes below were designed for the battery protection circuit

yjguohua

qwqwqw2088 Published on 2019-6-18 17:25 There is no need to place holes at the chip welding position. The solder is buried. The hole diameter is between 0.3mm--0.6mm. The hole spacing is controlled by yourself. Pay attention to the PCB strength and don't...

Do we only drill heat dissipation holes on the copper foil around the chip pads? Is the heat dissipation sufficient?

In addition, under what circumstances should we consider the problem of tin leakage?

qwqwqw2088

yjguohua posted on 2019-6-18 17:57 Do you only drill heat dissipation holes on the copper foil around the chip pads? Is the heat dissipation sufficient? In addition, under what circumstances should the problem of tin leakage be considered?

If you want to drill holes and worry about tin leakage, you can ask the board factory to plug the holes to prevent

How many holes should be drilled to determine whether the heat dissipation is sufficient

You need to look at the chip. To calculate accurately, you probably need to look at the parameters in the manual in detail, such as the thermal resistance from the chip core to the shell θ JC, the thermal resistance from the tube shell to the copper clad board θ CS, and the thermal resistance from the copper clad board heat dissipation surface to the environment control θ SA. You can
make an estimate similar to the method of calculating and selecting a radiator.
Or refer to the recommended heat dissipation form of the chip.

If the manufacturer has an evaluation board for this chip, you can refer to

yjguohua

qwqwqw2088 posted on 2019-6-18 18:22 If you want to drill holes but are worried about tin leakage, you can ask the board factory to make plug holes to prevent drilling. The amount of heat dissipation depends on the chip. If you want to calculate accurately, it is estimated that...

Got it, thanks!